NXP Brings GaN to 5G Multi-Chip Modules for Energy-Efficient Mobile Networks
June 28 2021 - 2:00AM
NXP Semiconductors N.V. (NASDAQ: NXPI) today announced a major
industry milestone for 5G energy efficiency with the integration of
Gallium Nitride (GaN) technology to its multi-chip module platform.
Building on the company’s investment in its GaN fab in Arizona, the
most advanced fab dedicated to RF power amplifiers in the United
States, NXP is the first to announce RF solutions for 5G massive
MIMO that combine the high efficiency of GaN with the compactness
of multi-chip modules.
Reducing energy consumption is a major goal for telecom
infrastructure, where every point of efficiency counts. The use of
GaN in multi-chip modules increases lineup efficiency to 52% at 2.6
GHz—8 percentage points higher than the company’s previous
module generation. And NXP has further improved performance with a
proprietary combination of LDMOS and GaN in a single device,
delivering 400 MHz of instantaneous bandwidth that makes it
possible to design wideband radios with a single power
amplifier.
This energy efficiency and wideband performance are now
available in the small footprint of NXP’s 5G multi-chip modules.
The new portfolio will enable RF developers to reduce the size and
weight of radio units, helping mobile network operators lower the
cost of deploying 5G on cellular towers and rooftops. In a single
package, the modules integrate a multi-stage transmit chain, 50-ohm
in/out matching networks and a Doherty combiner—and NXP is now
adding bias control using its latest SiGe technology. This new step
in integration removes the need for a separate analog control IC
and provides tighter monitoring and optimization of power amplifier
performance.
“NXP has developed a unique technology toolbox dedicated to 5G
infrastructure that includes proprietary LDMOS, GaN and SiGe, as
well as advanced packaging and RF design IP,” said Paul Hart,
executive vice president and general manager of the Radio Power
Business Line at NXP. “This enables us to leverage the benefits of
each element and combine them in the most optimal way for each use
case.”
Like the previous module generation, the new devices are
pin-to-pin compatible. RF engineers can rapidly scale a single
power amplifier design across multiple frequency bands and power
levels, reducing design cycle time and accelerating the roll-out of
5G around the globe.
AvailabilityNXP’s new 5G multi-chip modules
will sample in Q3, with production starting later this year. The
devices will be supported by NXP’s new RapidRF series of RF
front-end board designs that helps accelerate the design of 5G
systems.
NXP’s 5G Access Edge PortfolioFrom
antenna-to-processor, NXP offers a robust portfolio of technologies
for accelerating 5G deployments that delivers best-of-class
performance and security for infrastructure, industrial, and
automotive applications. This includes the company’s Airfast
family of RF power solutions and its Layerscape family of multicore
processors for wireless data links, fixed wireless access, and
small cell devices. To learn more, visit nxp.com/5G.
About NXP SemiconductorsNXP Semiconductors
N.V. (NASDAQ: NXPI) enables secure connections for a smarter
world, advancing solutions that make lives easier, better, and
safer. As the world leader in secure connectivity solutions for
embedded applications, NXP is driving innovation in the automotive,
industrial & IoT, mobile, and communication infrastructure
markets. Built on more than 60 years of combined experience and
expertise, the company has approximately 29,000 employees in more
than 30 countries and posted revenue of $8.61 billion in
2020. Find out more at www.nxp.com.
NXP, the NXP logo and EdgeLock are trademarks of NXP B.V.
All other product or service names are the property of their
respective owners. All rights reserved. © 2021 NXP B.V.
For more information, please contact:
Americas &
Europe |
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Greater China /
Asia |
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Jason Deal |
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Ming Yue |
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Tel: +44 7715228414 |
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Tel: +86 21 2205 2690 |
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Email: jason.deal@nxp.com |
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Email: ming.yue@nxp.com |
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NXP-CorpNXP-IoT
A photo accompanying this announcement is available at
https://www.globenewswire.com/NewsRoom/AttachmentNg/c7c045ea-b759-482b-a8f0-06b0c6aa1b17
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