PITTSBURGH, April 24, 2019 /PRNewswire/ -- TSMC
certified ANSYS (NASDAQ: ANSS) solutions for its innovative
System-on-Integrated-Chips (TSMC-SoIC™) advanced 3D chip
stacking technology. SoIC is an advanced
interconnect technology for multi-die stacking on system-level
integration using Through Silicon Via (TSV) and chip-on-wafer
bonding process — enabling customers with greater power efficiency
and performance for highly complex and demanding cloud and data
center applications.
ANSYS multiphysics solutions for SoIC enable multi-die
co-simulation and co-analysis for extraction, power and signal
integrity analysis, power and signal electromigration analysis, and
thermal and thermal-induced stress analysis.
In addition to SoIC certification, TSMC validated the reference
flow for the latest Chip-on-Wafer-on-Substrate (CoWoS®)
packaging technology using ANSYS® RedHawk™,
ANSYS® RedHawk-CTA™,
ANSYS® CMA™ and
ANSYS® CSM™ and their corresponding chip
models for system level analysis.
"We're pleased with the result of our collaboration with ANSYS
in delivery of TSMC-SoIC™ technology reference flow, which empowers
customers to address growing performance, reliability and power
demands for cloud and data center applications," said Suk Lee, senior director, design infrastructure
management division at TSMC. "The collaborative efforts combining
ANSYS' comprehensive chip-package co-analysis solutions with TSMC
SoIC advanced chip stacking technology address complex multiphysics
challenges in 3D-IC packaging technologies."
"Our 3D-IC solutions address complex multiphysics challenges to
meet the stringent power, performance, thermal and reliability
requirements," said John Lee,
general manager at ANSYS. "ANSYS' comprehensive chip aware system
and system aware chip signoff solutions empower mutual customers to
accelerate design convergence with greater confidence."
About ANSYS, Inc.
If you've ever seen a rocket launch, flown on an airplane,
driven a car, used a computer, touched a mobile device, crossed a
bridge or put on wearable technology, chances are you've used a
product where ANSYS software played a critical role in its
creation. ANSYS is the global leader in engineering
simulation. Through our strategy of Pervasive Engineering
Simulation, we help the world's most innovative companies deliver
radically better products to their customers. By offering the best
and broadest portfolio of engineering simulation software, we help
them solve the most complex design challenges and create products
limited only by imagination. Founded in 1970, ANSYS is
headquartered south of Pittsburgh,
Pennsylvania, U.S.A., Visit www.ansys.com for more
information.
ANSYS and any and all ANSYS, Inc. brand, product, service and
feature names, logos and slogans are registered trademarks or
trademarks of ANSYS, Inc. or its subsidiaries in the United States or other countries
ANSS - C
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Media
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Mary Kate
Joyce
724.820.4368
marykate.joyce@ansys.com
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Investors
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Annette Arribas,
IRC
724.820.3700
annette.arribas@ansys.com
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SOURCE ANSYS, Inc.