Aehr Receives Order From New Customer for FOX-NP™ System for Production Test and Burn-in of Silicon Photonics Devices
January 23 2019 - 7:30AM
Aehr Test Systems (NASDAQ: AEHR), a worldwide
supplier of semiconductor test and burn-in equipment, today
announced it has received an order from a new customer for a FOX-NP
TM Test and Burn-in System and DiePak® Carrier as the first step in
its commitment to utilize Aehr’s FOX-P TM Platform for
qualification and production burn-in of their new family of
integrated silicon photonics chips.
This new customer will begin initial production test and burn-in
using Aehr’s new low cost, small footprint entry-level FOX-NP
system for initial product development, qualification and
production, and then plans to transition to high volume production
test and burn-in of 100% of their silicon photonics chips using
Aehr’s FOX-XPTM multi-wafer and singulated die/module test
solution. The order includes a custom DiePak® carrier for
performing both electrical and optical tests per integrated die at
512 singulated die per DiePak carrier, enabling test and burn-in of
over 1000 singulated die devices in parallel with the FOX-NP system
and over 4,600 devices in parallel with the FOX-XP system.
Gayn Erickson, President and CEO of Aehr, commented, “We
are pleased to announce another new customer for our FOX-P
Platform, beginning with this initial order for our new FOX-NP test
and burn-in system to support their product development and to
begin production ramp of their silicon photonics chips. They then
plan to transition to high volume production test and burn-in of
their singulated bare die using our FOX-XP system.
“The FOX-NP system is a new product within our FOX-P family that
offers a lower cost entry-level system to provide a configuration
and price point for companies to do initial production
qualification and new product introduction, enabling an easier
transition to the FOX-XP system for full production test. This new
FOX-NP system is 100% compatible with the FOX-XP system and is
configurable with up to two blades per system compared to up to 18
blades in the FOX-XP system.
“We are very optimistic about the silicon photonics and
photonics sensors markets and believe they will be significant
growth drivers for Aehr. Market research company Yole Développement
predicts silicon photonics technology will grow from being used in
a few percent of the total optical transceiver market in 2016 to
35% of the market in 2025, with a market value for transceivers of
almost $4 billion in 2025. The rapid growth of integrated optical
devices in high-performance servers and data centers, mobile
devices, automotive applications, and now wearable biosensors is
driving substantially higher requirements for initial quality and
long-term reliability, and the requirements are increasing with
every new product generation. We believe these new applications are
driving an entirely new level of quality and reliability
expectation for these systems and pose a significant long-term
growth opportunity for Aehr.”
For further perspective on the silicon photonics market, the
Yole Développement article is available at
http://www.yole.fr/SiPhotonics_MarketStatus.aspx.
Aehr’s FOX-P Platform is the company’s next-generation
multi-wafer and singulated die/module test solution that is capable
of functional test and burn-in/cycling of photonics devices, flash
memories, microcontrollers, sensors, and other leading-edge ICs
before they are assembled into single or multi-die stacked
packages. The FOX wafer-level systems utilize Aehr’s FOX WaferPakTM
contactors, which provide cost effective solutions for making
electrical contact with a full wafer or substrate in a multi-wafer
environment. The configuration with the DiePak® Carriers enables
burn-in of singulated die and multi-die modules to screen for
defects in both the die and the module assembly process. The
resulting known-good die, single-die or stacked-die packaged parts
can then be used for high reliability and quality applications such
as enterprise solid state drives, automotive devices, highly
valuable mobile applications, and mission critical integrated
circuits and sensors.
The key features of the FOX-P Platform that contribute to the
cost-effectiveness of the solution include the ability to provide
up to 2,048 “Universal Channels” per wafer or DiePak carrier, which
allows the system to test all the devices on the wafer or DiePak
carrier in parallel. The innovative “Universal Channel”
architecture allows any channel to be any function (I/O, Device
Power Supply (DPS) or Per-pin Precision Measurement Unit (PPMU)).
This enhanced architecture now allows customers to perform per pin
parametric testing, more extensive digital pattern test with deeper
data stimulus / capture memory (32M per pin), and deeper scan
(768M) optimized for BIST/DFT testing. A single FOX-XP test system
may be configured with up to 18 blades of wafer test resources,
enabling up to 18 wafers to be tested simultaneously. The footprint
of the 18-wafer test system is similar to the footprint of typical
semiconductor Automatic Test Equipment (ATE) that can only test one
wafer at a time. The highly integrated 2-blade FOX-NP system has a
very small footprint and is designed to be easily integrated into
product design, reliability and test lab applications.
About Aehr Test Systems Headquartered in
Fremont, California, Aehr Test Systems is a worldwide provider of
test systems for burning-in and testing logic, optical and memory
integrated circuits and has over 2,500 systems installed worldwide.
Increased quality and reliability needs of the Automotive and
Mobility integrated circuit markets are driving additional test
requirements, incremental capacity needs, and new opportunities for
Aehr products in package, wafer level, and singulated die/module
level test. Aehr has developed and introduced several innovative
products, including the ABTS™ and FOX-P™ families of test and
burn-in systems and the FOX WaferPak™ Aligner, FOX WaferPak
Contactor, FOX DiePak® Carrier and FOX DiePak Loader. The ABTS
system is used in production and qualification testing of packaged
parts for both lower power and higher power logic devices as well
as all common types of memory devices. The FOX-XP and FOX-NP
systems are full wafer contact and singulated die/module test and
burn-in system used for burn-in and functional test of complex
devices, such as leading-edge memories, digital signal processors,
microprocessors, microcontrollers, systems-on-a-chip, and
integrated optical devices. The WaferPak contactor contains a
unique full wafer probe card capable of testing wafers up to 300mm
that enables IC manufacturers to perform test and burn-in of full
wafers on Aehr FOX systems. The DiePak Carrier is a reusable,
temporary package that enables IC manufacturers to perform
cost-effective final test and burn-in of both bare die and modules.
For more information, please visit Aehr’s website at
www.aehr.com.
Safe Harbor Statement This press release
contains certain forward-looking statements based on current
expectations, forecasts and assumptions that involve risks and
uncertainties. These statements are based on information available
to Aehr as of the date hereof and actual results could differ
materially from those stated or implied due to risks and
uncertainties. Forward-looking statements include statements
regarding Aehr’s expectations, beliefs, intentions or strategies
regarding its products, including statements regarding future
market opportunities and conditions, expected product shipment
dates and customer orders or commitments. These risks and
uncertainties include, without limitation, customer demand and
acceptance of Aehr’s products, the ability of new products to meet
customer needs or perform as described, as well as general market
conditions and Aehr Test’s ability to execute on its business
strategy. See Aehr’s recent 10-K, 10-Q and other reports from time
to time filed with the Securities and Exchange Commission for a
more detailed description of the risks facing Aehr’s business. Aehr
disclaims any obligation to update information contained in any
forward-looking statement to reflect events or circumstances
occurring after the date of this press release.
Contacts:
Aehr Test
Systems
Carl Buck
V.P of Marketing
(510) 623-9400
x381
cbuck@aehr.com
MKR Group Inc.Todd Kehrli or
Jim ByersAnalyst/Investor Contact(323)
468-2300aehr@mkr-group.com
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