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ACMR ACM Research Inc

26.87
-1.42 (-5.02%)
Last Updated: 12:19:33
Delayed by 15 minutes

Period:

Draw Mode:

Volume 1,693,150
Bid Price 26.83
Ask Price 26.87
News (1)
Day High 28.94

Low
8.75

52 Week Range

High
34.3507

Day Low 25.3322
Company Name Stock Ticker Symbol Market Type
ACM Research Inc ACMR NASDAQ Common Stock
  Price Change Change Percent Stock Price Last Traded
-1.42 -5.02% 26.87 12:19:33
Open Price Low Price High Price Close Price Prev Close
26.07 25.3322 28.94 28.29
Trades Volume VWAP Dollar Volume Avg Volume 52 Week Range
20,520 1,693,150 $ 26.35 $ 44,622,145 - 8.75 - 34.3507
Last Trade Time Type Quantity Stock Price Currency
12:19:42 5 $ 26.84 USD

ACM Research (ACMR) Options Flow Summary

Overall Flow

Bullish

Net Premium

56k

Calls / Puts

100.00%

Buys / Sells

100.00%

OTM / ITM

100.00%

Sweeps Ratio

0.00%

ACM Research Inc Financials

Market Cap Shares in Issue Float Revenue Profit/Loss EPS PE Ratio
1.58B 61.10M - 557.72M 77.35M 1.27 20.42
Short Interest Dividends Per Share Dividend Yield Ex-Div Date Insider B/S Insider % Owned
- - - -

more financials information »

ACM Research News

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Historical ACMR Price Data

Period Open High Low VWAP Avg. Daily Vol Change %
1 Week27.0129.169424.5026.771,351,367-0.14-0.52%
1 Month29.5133.4024.5028.911,211,081-2.64-8.95%
3 Months16.8034.350715.7027.231,758,80510.0759.94%
6 Months18.3034.350712.5323.051,437,2228.5746.83%
1 Year9.6934.35078.7520.021,145,86817.18177.30%
3 Years81.68119.125.4625.66788,275-54.81-67.10%
5 Years16.07144.80655.4632.77608,02510.8067.21%

ACM Research Description

ACM Research Inc is an us-based company. It is engaged in developing, manufacturing, and selling single-wafer wet cleaning equipment, which is used by semiconductor manufacturers in numerous manufacturing steps to remove particles, contaminants, and other random defects to improve product yield, in fabricating integrated circuits, or chips. The company offers space alternated phase shift which employs alternating phases of megasonic waves to deliver megasonic energy to flat and patterned wafer surfaces on a microscopic level; and Timely Energized Bubble Oscillation technology which provides effective, damage-free cleaning for both conventional two and three-dimensional patterned wafers at process nodes.

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