Telit Communications PLC Telit and IBM accelerate global Industrial IoT
July 12 2018 - 2:00AM
RNS Non-Regulatory
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Telit Communications PLC
12 July 2018
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Telit Communications PLC
Telit and IBM accelerate global Industrial IoT
London, 12 July, 2018 - Telit Communications PLC ("Telit", "the
Group", AIM: TCM), a global enabler of the Internet of Things
(IoT), today announced that its deviceWISE IoT platform is now
fully interoperable with the IBM IoT platform, including a new
reseller agreement that enables manufacturers and other industrial
businesses to leverage the combined power of the world's
best-in-class solutions for IoT and artificial intelligence
(AI).
Working together, the two companies will help manufacturers and
other businesses to minimise the cost, risk, complexity and lead
time of deploying solutions for monitoring and control, industrial
automation, asset tracking and field service operations. This is
the latest example of Telit's global leadership in rapidly
onboarding and integrating industrial devices and assets into the
IoT, highlighting Telit's extensive device side experience and
industrial technology and services expertise.
The combination of IBM's Watson IoT platform and Telit's
deviceWISE IoT solution gives manufacturers and other industrial
businesses powerful new options for near-instant onboarding of
industrial products, systems and assets as well as applying
advanced analytics, artificial intelligence and application
development.
deviceWISE streamlines the process of integrating industrial IoT
(IIoT) devices and applications by providing a large library of
native device drivers and industrial protocols. This eliminates the
need for custom coding and other expensive, time-consuming
integration tasks, so businesses can add value to their IIoT bottom
line and realise competitive benefits even faster.
The IBM Watson IoT platform, available on the IBM Cloud, brings
real-time insights to IoT data and powerful artificial intelligence
(AI) based capabilities including cognitive analysis, machine
learning and natural language processing.
Yosi Fait, CEO of Telit, said:
"This new agreement enables manufacturers and other industrial
businesses to leverage the combined strength of the world's two
best solutions for IIoT and AI.
"By working together, we are ensuring that IIoT lives up to its
full potential for maximising efficiency, productivity and
more."
Stephan Biller, Vice President for Offering Management, IBM
Watson IoT said:
"AI makes it easier and faster for manufacturers to aggregate,
analyze and act on data from multiple sources.
"Telit's deviceWISE complements IBM Watson's AI capabilities,
making the two solutions a natural fit that benefit manufacturers
and other industrial businesses worldwide."
Enquiries:
Telit Communications PLC Tel: +972 3 7914000
Shir Stopper, Investor Relations
finnCap (Nomad and joint broker) Tel: +44 20 7220 0500
Henrik Persson/Giles Rolls (corporate finance)
Tim Redfern/Richard Chambers (corporate
broking)
Berenberg (Joint Broker) Tel: +44 20 3465 2722
Chris Bowman/Mark Whitmore/Ben Wright
Instinctif Partners Tel: +44 20 7457 2077
Adrian Duffield/Chantal Woolcock
About Telit
Telit (AIM: TCM), is a global leader in Internet of Things (IoT)
enablement, with an extensive portfolio of wireless connectivity
modules, platforms, virtual cellular IoT operator services, and
professional services, empowering hundreds of millions of connected
'things' to date, and trusted by thousands of direct and indirect
customers, globally. With nearly two decades of IoT innovation
experience, Telit continues to redefine the boundaries of digital
business, by delivering secure, integrated end-to-end IoT solutions
for many of the world's largest brands, including enterprises,
OEMs, system integrators and service providers across all
industries, enabling their pursuit of enterprise digital
transformation.
# # #
Copyright (c) 2018 Telit Communications PLC. All rights
reserved. Telit and all associated logos are trademarks of Telit
Communications PLC in the United States and other countries. Other
names used herein may be trademarks of their respective owners.
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