TIDMTCM

Telit Communications PLC

12 July 2018

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Telit Communications PLC

Telit and IBM accelerate global Industrial IoT

London, 12 July, 2018 - Telit Communications PLC ("Telit", "the Group", AIM: TCM), a global enabler of the Internet of Things (IoT), today announced that its deviceWISE IoT platform is now fully interoperable with the IBM IoT platform, including a new reseller agreement that enables manufacturers and other industrial businesses to leverage the combined power of the world's best-in-class solutions for IoT and artificial intelligence (AI).

Working together, the two companies will help manufacturers and other businesses to minimise the cost, risk, complexity and lead time of deploying solutions for monitoring and control, industrial automation, asset tracking and field service operations. This is the latest example of Telit's global leadership in rapidly onboarding and integrating industrial devices and assets into the IoT, highlighting Telit's extensive device side experience and industrial technology and services expertise.

The combination of IBM's Watson IoT platform and Telit's deviceWISE IoT solution gives manufacturers and other industrial businesses powerful new options for near-instant onboarding of industrial products, systems and assets as well as applying advanced analytics, artificial intelligence and application development.

deviceWISE streamlines the process of integrating industrial IoT (IIoT) devices and applications by providing a large library of native device drivers and industrial protocols. This eliminates the need for custom coding and other expensive, time-consuming integration tasks, so businesses can add value to their IIoT bottom line and realise competitive benefits even faster.

The IBM Watson IoT platform, available on the IBM Cloud, brings real-time insights to IoT data and powerful artificial intelligence (AI) based capabilities including cognitive analysis, machine learning and natural language processing.

Yosi Fait, CEO of Telit, said:

"This new agreement enables manufacturers and other industrial businesses to leverage the combined strength of the world's two best solutions for IIoT and AI.

"By working together, we are ensuring that IIoT lives up to its full potential for maximising efficiency, productivity and more."

Stephan Biller, Vice President for Offering Management, IBM Watson IoT said:

"AI makes it easier and faster for manufacturers to aggregate, analyze and act on data from multiple sources.

"Telit's deviceWISE complements IBM Watson's AI capabilities, making the two solutions a natural fit that benefit manufacturers and other industrial businesses worldwide."

Enquiries:

 
Telit Communications PLC                           Tel: +972 3 7914000 
 Shir Stopper, Investor Relations 
 
finnCap (Nomad and joint broker)                 Tel: +44 20 7220 0500 
 Henrik Persson/Giles Rolls (corporate finance) 
 Tim Redfern/Richard Chambers (corporate 
 broking) 
 
Berenberg (Joint Broker)                         Tel: +44 20 3465 2722 
 Chris Bowman/Mark Whitmore/Ben Wright 
 
Instinctif Partners                              Tel: +44 20 7457 2077 
Adrian Duffield/Chantal Woolcock 
 

About Telit

Telit (AIM: TCM), is a global leader in Internet of Things (IoT) enablement, with an extensive portfolio of wireless connectivity modules, platforms, virtual cellular IoT operator services, and professional services, empowering hundreds of millions of connected 'things' to date, and trusted by thousands of direct and indirect customers, globally. With nearly two decades of IoT innovation experience, Telit continues to redefine the boundaries of digital business, by delivering secure, integrated end-to-end IoT solutions for many of the world's largest brands, including enterprises, OEMs, system integrators and service providers across all industries, enabling their pursuit of enterprise digital transformation.

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Copyright (c) 2018 Telit Communications PLC. All rights reserved. Telit and all associated logos are trademarks of Telit Communications PLC in the United States and other countries. Other names used herein may be trademarks of their respective owners.

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