Varian and Soitec Collaborate on the Development of a New High Current Implanter for Future Silicon-On-Insulator Production Requ
April 30 2009 - 9:53AM
Marketwired
Varian Semiconductor Equipment Associates, Inc. ("Varian
Semiconductor") (NASDAQ: VSEA) today announced that they have
entered into a collaboration with Soitec (EURONEXT: SOI), the
world's leading supplier of silicon-on-insulator (SOI) substrates.
The two companies are collaborating on the development and
qualification of a new high current implanter to be used in
Soitec's patented Smart Cut(TM) technology for the production
requirements of upcoming generations of SOI wafers.
The Smart Cut technology used to manufacture SOI substrates
exploits ion implantation, wafer bonding and atomic level
splitting. Ion implantation weakens the silicon crystal at an
extremely precise depth and acts as an atomic scalpel, lifting off
a thin layer from the donor substrate and placing it onto a
different substrate.
The VIISta Single Wafer High Current implanter from Varian has
proven, dual-magnet technology that minimizes defectivity and
maximizes yield. Additionally, the use of ribbon beam technology
provides productivity, cost-of-ownership and uniformity advantages
for the splitting and layer transfer processes used in the Smart
Cut technology.
"Soitec is committed to meeting the industry's requirements for
the highest quality engineered substrates. Our collaboration with
the leading supplier of ion implant equipment is key for us to meet
the most advanced requirements in terms of uniformity, especially
for fully depleted applications at the 22 nm node," says Paul
Boudre, Chief Operating Officer of the Soitec Group.
Gary Dickerson, Chief Executive Officer of Varian, said, "We are
looking forward to working together with Soitec to enable future
device scaling with our dual-magnet ribbon beam technology. Through
this collaboration we have the opportunity to add a whole new
growth market to our portfolio of applications."
About Varian Semiconductor:
Varian Semiconductor Equipment Associates is the leading
supplier of ion implant equipment to semiconductor manufacturers,
enabling them to pack more, higher performing transistors into
computer chips that are revolutionizing the electronics industry.
Varian Semiconductor's products are used by chip manufacturers
worldwide to produce high-performance semiconductor devices.
Customers have made Varian Semiconductor the market leader in ion
implant because of its architecturally superior products that lower
their costs and improve their productivity. The Company has ranked
#1 in the VLSI Research Customer Satisfaction Survey 11 times over
the last 12 years. Varian Semiconductor operates globally and is
headquartered in Gloucester, Massachusetts. More information can be
found on Varian Semiconductor's web site at www.vsea.com.
About Soitec:
Soitec is the world's leading supplier of engineered substrates
for advanced microelectronics. The Group produces a wide range of
advanced materials, especially silicon-on-insulator (SOI) wafers
based on its Smart Cut(TM) technology -- the first high-volume
application for this proprietary technology. SOI is currently seen
as the platform of the future, paving the way to
higher-performance, faster, and more economical chips.
Soitec currently produces over 80% of the worldwide market for
SOI wafers. Headquartered at Bernin in France, with two high-volume
production units on site, Soitec also has offices in the US, Japan,
and Taiwan, and a new production site is in the process of
customers' qualification in Singapore.
The Group has two other divisions: Picogiga International at Les
Ulis in Paris and Tracit Technologies in Bernin. Picogiga is
specialized in the development and manufacture of engineered
substrates, from group III-V epitaxial semiconductor wafers and
gallium nitride (GaN) wafers to composite substrates for the
manufacture of high-frequency electronics and optoelectronic
devices. Tracit is specialized in thin-film layer transfer
technologies, used to manufacture engineered substrates for power
ICs and microsystems, as well as generic circuit transfer
technology for applications such as image sensors and 3D
integration. Shares for the Soitec Group are listed on Euronext
Paris. More information is available at www.soitec.com
Soitec, Smart Cut, and UNIBOND are trademarks of S.O.I.TEC
Silicon On Insulator Technologies.
Note: This press release contains forward-looking statements for
purposes of the safe harbor provisions under The Private Securities
Litigation Reform Act of 1995. For this purpose, statements
concerning the industry outlook, expected product plans, market
conditions, Varian Semiconductor's investment in new product and
application development, and any statements using the terms
"believes," "anticipates," "will," "expects," "plans" or similar
expressions, are forward-looking statements. The forward-looking
statements involve a number of risks and uncertainties. Among the
important factors that could cause actual results to differ
materially from those indicated by such forward-looking statements
are: volatility in the semiconductor equipment industry; intense
competition in the semiconductor equipment industry; Varian
Semiconductor's dependence on a small number of customers;
fluctuations in Varian Semiconductor's quarterly operating results;
Varian Semiconductor's transition to new products; Varian
Semiconductor's exposure to risks of operating internationally;
uncertain protection of Varian Semiconductor's patent and other
proprietary rights; Varian Semiconductor's reliance on a limited
group of suppliers; Varian Semiconductor's ability to manage
potential growth, decline and strategic transactions; Varian
Semiconductor's reliance on one primary manufacturing facility; and
Varian Semiconductor's dependence on certain key personnel. These
and other important risk factors that may affect actual results are
discussed in detail under the caption "Risk Factors" in Varian
Semiconductor's Annual Report on Form 10-K for the year ended
October 3, 2008 and in other reports filed by Varian Semiconductor
with the Securities and Exchange Commission. Varian Semiconductor
cannot guarantee any future results, levels of activity,
performance or achievement. Varian Semiconductor undertakes no
obligation to update any of the forward-looking statements after
the date of this release.
Contacts: Bob Halliday Executive Vice President and Chief
Financial Officer 978.282.7597 or Tom Baker Vice President, Finance
978.282.2301
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