YAVNE, Israel, July 11, 2017 /PRNewswire/ --
ORBOTECH LTD. (NASDAQ: ORBK), today announced that SPTS
Technologies, an Orbotech company and supplier of advanced wafer
processing solutions for the global semiconductor and related
industries, has been named by imec, a world-leading
nano-electronics research center, as a new supplier of physical
vapor deposition (PVD) solutions for under bump metallization (UBM)
and redistribution layer (RDL) processes for next generation
fan-out packaging technologies. Imec has selected SPTS's
Sigma® fxP PVD solution as the new process tool
of record (PTOR) for low temperature PVD for development of novel
fan-out technologies such as flexible micro-bumps for chip scale
packaging.
"To meet the technical requirements of future micro- and
nano-electronics, novel 3D integrated circuit (IC) architectures
need to be developed to meet scaling challenges without
compromising cost, performance, and power budgets," stated
Kevin Crofton, President of SPTS
Technologies and Corporate Vice President at Orbotech. "Imec works
closely with leading semiconductor companies to develop innovative
wafer-level packaging architectures that will meet the performance
requirements of next generation devices such as application
processors that drive virtual reality applications or enable high
performance computing for artificial intelligence. We are proud
that imec selected SPTS' Sigma® for its 3D System
Integration Program, reflecting our PVD solutions' excellent
results, particularly in low temperature RDL and copper pillar
creation on low temperature tolerant polymers. We look
forward to working with imec and its partners in developing
innovative interconnect and fan-out technologies."
Mr Crofton added," SPTS specializes in UBM/RDL PVD for Flip Chip
and fan-out applications, and our low temperature PVD capabilities
will support the development of a range of new interconnect
technologies at imec, including flexi bumps, to address the scaling
and packaging needs of future generations of nano-electronics."
Dr Anthony Barker, PVD Product
Manager at SPTS, will be giving an invited talk titled: "Fantastic
Fan-out; Improving Interconnect Productivity for the Fastest
Growing Packaging Platform" on Thursday 13 July, 14.00 - 14.30 at
the Advanced Packaging Meet the Expert Session, at SEMICON West, in
San Francisco.
To learn more about SPTS's Sigma fxP PVD solutions, and
full range of industry leading etch, deposition, and inkjet
solutions for advanced packaging applications visit SPTS
Technologies on Booth No.7617 in West Hall at SEMICON West, 11 - 13
July, Moscone Center, San
Francisco.
About Sigma® fxP
PVD
The Sigma fxP is a cluster PVD system used by device
manufacturers in various end markets including power management,
MEMS and RF devices. In semiconductor packaging, the Sigma
fxP deposits RDL and under bump metals (UBM) for Cu
micropillar and TSV's, plus TSV liner/barrier for 3DWLP. For
FOWLP, the system carries a Multi Wafer Degas (MWD) for low
temperature, high productivity degas of epoxy mold compound.
Its SE-LTX etch module pre-cleans organic films with twice
the mean wafers between cleans (MWBC) compared to competing
systems.
About Orbotech Ltd.
Orbotech Ltd. is a leading global supplier of yield-enhancing
and process-enabling solutions for the manufacture of electronics
products. Orbotech provides cutting-edge solutions for use in the
manufacture of printed circuit boards (PCBs), flat panel displays
(FPDs), and semiconductor devices, designed to enable the
production of innovative, next generation electronic products and
improve the cost effectiveness of existing and future electronics
production processes. Orbotech's core business lies in enabling
electronic device manufacturers to inspect and understand PCBs and
FPDs and to verify their quality, pattern the desired electronic
circuitry on the relevant substrate and perform three dimensional
shaping of metalized circuits on multiple surfaces, and utilize
advanced vacuum deposition and etching processes in SD and
semiconductor manufacturing. For further information, visit
http://www.orbotech.com and http://www.spts.com
Cautionary Statement Regarding Forward-Looking
Statements
Except for historical information, the matters discussed in this
press release are forward-looking statements within the meaning of
the U.S. Private Securities Litigation Reform Act of 1995.
These statements relate to, among other things, future
prospects, developments and business strategies and involve certain
risks and uncertainties. The words "anticipate," "believe,"
"could," "will," "plan," "expect" and "would" and similar terms and
phrases, including references to assumptions, have been used in
this press release to identify forward-looking statements.
These forward-looking statements are made based on
management's expectations and beliefs concerning future events
affecting Orbotech and are subject to uncertainties and factors
relating to Orbotech's operations and business environment, all of
which are difficult to predict and many of which are beyond the
Company's control. Many factors could cause the actual
results to differ materially from those projected including,
without limitation, cyclicality in the industries in which the
Company operates, the Company's production capacity, timing and
occurrence of product acceptance (the Company defines 'bookings'
and 'backlog' as purchase arrangements with customers that are
based on mutually agreed terms, which, in some cases for bookings
and backlog, may still be subject to completion of written
documentation and may be changed or cancelled by the customer,
often without penalty), fluctuations in product mix, within and
among divisions, worldwide economic conditions generally,
especially in the industries in which the Company operates, the
timing and strength of product and service offerings by the Company
and its competitors, changes in business or pricing strategies,
changes in the prevailing political and regulatory framework in
which the relevant parties operate, including as a result of the
Brexit process and administration change in the United States, or in economic or
technological trends or conditions, including currency
fluctuations, inflation and consumer confidence, on a global,
regional or national basis, the level of consumer demand for
sophisticated devices such as smartphones, tablets and other
electronic devices as well as automobiles, the Company's global
operations and its ability to comply with varying legal,
regulatory, exchange, tax and customs regimes, the timing and
outcome of tax audits, including the ongoing process with respect
to the $58 million tax assessment for
the years 2012-2014 and associated criminal investigation by the
Israel Tax Authority (any estimation of the potential outcome of an
uncertain tax issue is a matter for judgment, which can be
subjective and highly complex; however, the Company believes that
it has provided adequately for any reasonably foreseeable outcomes
related to the tax audit, but future results may include favorable
or unfavorable material adjustments to estimated tax liabilities in
the periods when the assessments and investigations are resolved or
the audit and investigation are closed), harm to the Company's
reputation from ITA's investigation and any adverse impact on its
business and opportunities, the Company's ability to achieve
strategic initiatives, including related to its acquisition
strategy, the Company's debt and corporate financing activities;
the final timing and outcome, and the impact, of the criminal
matter and ongoing investigation in Korea, including any impact on
existing or future business opportunities in Korea and elsewhere,
any civil actions related to the Korean matter brought by third
parties, including the Company's customers, which may result in
monetary judgments or settlements, expenses associated with the
Korean matter, ongoing or increased hostilities in Israel and the surrounding areas, and other
risks detailed in the Company's SEC reports, including the
Company's Annual Report on Form 20-F for the year ended
December 31, 2016, and subsequent SEC
filings. The Company assumes no obligation to update the
information in this press release to reflect new information,
future events or otherwise, except as required by law.
ORBOTECH COMPANY CONTACTS:
Rami Rozen
Director of Investor Relations
Tel: +972-8-942-3582
Investor.relations@orbotech.com
Tally Kaplan Porat
Director of Corporate Marketing
Tel: +972-8-942-3603
Tally-Ka@orbotech.com
SOURCE Orbotech Ltd.