FSI International Receives Multiple ORION® System Orders

FSI International, Inc. (Nasdaq: FSII), a leading manufacturer of surface conditioning equipment for microelectronics manufacturing, announced today that it received multiple ORION® single wafer cleaning system orders. The orders were received during the third quarter of fiscal 2011 and are expected to ship in the second half of calendar 2011.

One customer is a memory producer that plans to use the system for front-end-of-line (FEOL) wet photoresist strip and middle-of-line (MOL) metal etch applications. Increasingly, memory manufacturers are transitioning from batch immersion to single wafer technology to improve defectivity and cycle time performance. The ORION® system with its inherent short process times and integrated atomized spray bar provides these benefits.

The second customer is a foundry producer and will use the system for back-end-of-line (BEOL) cleaning processes. Foundry and logic manufacturers are finding low-k materials and metal film stacks used for advanced devices are much more sensitive to wet cleaning than previous generations of BEOL processes. The closed chamber technology of the ORION® system has demonstrated highly efficient removal of etch and ash by-products without causing galvanic corrosion or changes in metal and dielectric film properties.

FSI International, Inc. is a global supplier of surface conditioning equipment, technology and support services for microelectronics manufacturing. Using the company’s broad portfolio of cleaning products, which include batch and single-wafer platforms for immersion, spray, vapor and cryogenic aerosol technologies, customers are able to achieve their process performance flexibility and productivity goals. The company’s support services programs provide product and process enhancements to extend the life of installed FSI equipment, enabling worldwide customers to realize a higher return on their capital investment. For more information, visit FSI’s website at http://www.fsi-intl.com.

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