FSI International, Inc. (Nasdaq: FSII), a leading supplier of surface conditioning equipment for microelectronics manufacturing, announced today that it shipped its FSI ORION® single wafer processing system to another leading Asian semiconductor manufacturing customer. The qualification system will be used in ashless all-wet photoresist strip and wet metal etch applications for the development and production of memory devices. Revenues from shipments of production use systems for this customer are expected to begin in the second half of 2011.

Unique among single wafer processing tools, the closed chamber design of the FSI ORION system effectively contains process chemicals, permitting the use of the aggressive, high-temperature sulfuric peroxide mixture (SPM) chemistry of the ViPR™ process. Standard SPM chemistries are unable to completely strip photoresists exposed to higher levels of ion implantation unless first subjected to a plasma ashing step. The ViPR process effectively strips in one step by wet chemical action alone, providing both manufacturing cycle time and lower operating cost benefits to the customer. Additionally, the ViPR process removes resists while preserving the customer’s device materials such as silicon nitride achieving silicon nitride losses as low as 0.1 nanometer.

FSI International, Inc. is a global supplier of surface conditioning equipment, technology and support services for microelectronics manufacturing. Using the company’s broad portfolio of cleaning products, which include batch and single-wafer platforms for immersion, spray, vapor and cryogenic aerosol technologies, customers are able to achieve their process performance, flexibility and productivity goals. The company’s support services programs provide product and process enhancements to extend the life of installed FSI equipment, enabling worldwide customers to realize a higher return on their capital investment. For more information, visit FSI’s website at http://www.fsi-intl.com.

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