FSI Receives ORION® Single Wafer Cleaning System Order from Leading Global Semiconductor Foundry for 32/28nm FEOL Applications
June 24 2010 - 4:05PM
Business Wire
FSI International, Inc. (Nasdaq: FSII), a leading supplier of
surface conditioning equipment for microelectronics manufacturing,
announced today that it has received an order for its ORION single
wafer processing system from a second major semiconductor foundry
based in Asia. The ORION system, scheduled to ship later this
summer, was selected primarily for its superior performance in
nickel platinum (NiPt) silicide processing and all-wet photoresist
stripping in 32/28nm front-end-of-line (FEOL) applications.
“This order is evidence of the performance advantages offered by
the ORION system in advanced processing applications,” said John
Ely, Vice President of Global Sales, Marketing and Service at FSI.
“The selection was made after a rigorous competitive evaluation.
FSI successfully demonstrated the ORION system’s unique ability to
completely remove unreacted NiPt (10%) and to provide all-wet
photoresist stripping using the high temperature ViPRTM process.
This order also represents the continued success and acceptance of
FSI’s leading advanced single wafer cleaning technology by the
world’s leading foundries,” continued Ely.
Unique among single wafer processing tools, the ORION system’s
closed chamber design effectively contains process chemicals,
permitting the use of the aggressive, high temperature sulfuric
peroxide mixture (SPM) chemistry of the ViPR process. Standard SPM
chemistries are unable to completely remove unreacted platinum
(Pt). Hydrochloric acid (HCl) based chemistries can remove the
metal, but cause parasitic oxidation of the silicide. The ViPR
process effectively removes unreacted Pt without causing parasitic
oxidation, thus improving the quality, repeatability and speed of
metal stripping in advanced NiPt salicide processes and extending
the use of these processes to future CMOS generations. At the same
time, the high reactivity of the ViPR process enables the ORION
system to strip implanted photoresist by wet chemical action alone
(for all but the most extreme implant conditions), eliminating the
need for ashing and reducing the stripping sequence to a fast,
single step.
About FSI InternationalFSI International, Inc. is a
global supplier of surface conditioning equipment, technology and
support services for microelectronics manufacturing. Using the
company’s broad portfolio of cleaning products, which include batch
and single-wafer platforms for immersion, spray, vapor and
cryogenic aerosol technologies, customers are able to achieve their
process performance, flexibility and productivity goals. The
company’s support services programs provide product and process
enhancements to extend the life of installed FSI equipment,
enabling worldwide customers to realize a higher return on their
capital investment. For more information, visit FSI’s website at
http://www.fsi-intl.com.
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