ENWV Endwave Corp. (MM)

Endwave to Apply Advanced Epsilon (R) Packaging Technology to Multi-Gigabit Radios SUNNYVALE, Calif., Nov. 10 /PRNewswire-FirstCall/ -- Endwave Corporation (NASDAQ:ENWV), a leading provider of high-frequency RF modules for telecommunications networks, defense electronics, and homeland security systems, has partnered with Loea Corporation to design 71.0-86.0 GHz subsystems for use in Loea's multi-gigabit wireless radios. Specifically, Endwave will develop transmitter and receiver modules that perform the critical frequency conversion functions within Loea's radio. To counter the high costs of conventional mechanical housings, covers and other packaging in typical millimeter-wave modules, Endwave will incorporate Epsilon(R) Packaging technology into its designs for Loea. Epsilon(R) Packaging eliminates the traditional dependency on bulky machined or cast mechanical housings by replacing costly mechanical items with metallized FR-4 and injection molded metallized plastics. The end result is a package with no machined metal parts that is mass producible with minimal weight and size. Epsilon(R) Packaging is targeted at high-frequency applications where low cost, light weight and small form-factor are essential. Loea pioneered the use of the newly available spectrum allocated by the FCC and NTIA in the 71-76 GHz, 81-86 GHz and 92-95 GHz bands. Loea's products provide unique last-mile access performance, including high all-weather availability (99.999% at 1 km), ultra broadband data payload (1.25 Gbps) and a low overall cost of ownership compared to alternative last-mile access technologies. Loea is currently manufacturing 1.25 Gbps duplex ultra broadband wireless radio links and plans to extend the product offering to include radio systems with data rates up to 10 Gbps. "Endwave Corporation is extremely pleased to have been selected by Loea as its transceiver subsystem provider for the emerging 70/80 GHz wireless market," said Ed Keible, CEO and President of Endwave Corporation. "Endwave's innovative Epsilon(R) Packaging is a perfect match for Loea's transceivers and the advanced performance requirements of Loea products," added Keible. "Our partnership with Endwave will contribute significantly to Loea's product strategy to incorporate innovative solutions that reduce equipment size and costs," said Loea Corporation President and CEO, Dr. Daniel Scharre. "The combination of lower cost and higher performance will enable market development for wireless access and backhaul applications at speeds previously unattainable." About Loea Corporation Loea Corporation, a subsidiary of Trex Enterprises, is a communications equipment designer and manufacturer. Loea has been in operation since May of 2001 and has been deploying fixed wireless systems since 2002. Loea products offer ultra-broadband last-mile access solutions for campus or enterprise users, metro Ethernet businesses and service providers. Loea products are also used in infrastructure applications such as broadband cellular network extension and backhaul for next generation data networks. For more information visit http://www.loeacom.com/. About Endwave Corporation Endwave Corporation designs, manufactures, and markets RF modules that enable the transmission, reception and processing of high-frequency signals in telecommunications networks, defense electronics and homeland security systems. Endwave's RF modules are typically used in high-frequency applications and include integrated transceivers, amplifiers, synthesizers, oscillators, up and down converters, frequency multipliers and microwave switch arrays. Endwave has 38 issued patents covering its core technologies including semiconductor and proprietary circuit designs. Endwave Corporation is headquartered in Sunnyvale, CA, with operations in Diamond Springs, CA; Andover, MA; and Chiang Mai, Thailand. Additional information about the company can be accessed from the company's web site at http://www.endwave.com/ . About Endwave's Epsilon(R) Packaging Technology Despite tremendous technological advances in semiconductor technologies, manufacturing techniques, and design tools, conventional millimeter-wave module housings continue to bear a distinct resemblance to those utilized when the industry was in its infancy and almost completely dedicated to defense applications. To a large extent these housings are fabricated utilizing costly precision machining techniques, after which they are gold plated. A high-frequency board material is mounted to the floor of the housing with conductive epoxy, semiconductor devices are installed in pockets in the board, and wire bonds connect the active components to microstrip traces on the substrate. The assembly is often not planar, which increases assembly time and costs. As a result, as advances in other areas have driven costs down, housing costs have become an ever-increasing percentage of the total cost of the bill of material and housing imposed assembly constraints have limited the benefits that might otherwise be gained by automated assembly. Endwave is addressing these cost drivers through a company funded research and development effort known as Epsilon(R) Packaging. Endwave's proprietary Epsilon(R) Packaging technology makes innovative use of existing printed circuit board fabrication techniques to achieve mass production of modules having efficient heat extraction with minimal weight and size. A single integrated board stack accepts both low-cost surface-mount components and wire-bonded chip-on-board components. Light-weight multilayer FR4 material furnishes the structural support and integrates the surface-mount components including silicon ball-grid-array chip-scale components for digital control, power conditioning, and other signal processing functions. Multi-laminate techniques using higher frequency soft substrates, as well as the ability to integrate ceramic substrates like Alumina, Quartz, Fused Silica or Endwave's proprietary Multilithic Microsystems TM (MLMS) circuits, allow for efficient upper frequency support well above 100 GHz. Excellent electrical shielding and environmental sealing of the RF circuitry is achieved through the use of advanced shallow blind-via slot technology and through the use of minimum-mass conductive-epoxy-attached metal-clad FR-4 lids. Selective permeability techniques prevent hydrogen poisoning while providing field-proven environmental protection. The package has no ceramic or machined metal parts. The technology utilizes the same materials and techniques that have proven reliable in Endwave transceivers over the last several years in hundreds of thousands of radios deployed worldwide in harsh terrestrial environments. The primary benefits of the Epsilon(R) Packaging approach are: -- A multi-layer substrate and module package, all in one -- A highly reduced cost mechanical bill of materials -- A completely planar RF assembly that facilitates either manual or auto assembly -- Enhanced reproducibility -- Improved thermal management -- Smaller form-factor -- Less weight The Epsilon(R) Packaging approach represents a major shift in how millimeter-wave modules are assembled and enable major reductions in the cost of these modules. "Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995: This press release may contain forward-looking statements within the meaning of the Federal securities laws and is subject to the safe harbor created thereby. Any statements contained in this press release that are not statements of historical fact may be deemed to be forward-looking statements. Words such as "plans," "intends," "expects," "believes" and similar expressions are intended to identify these forward-looking statements. Information contained in forward-looking statements is based on current expectations and is subject to change. Actual results could differ materially from the forward-looking statements due to many factors, including the following: our ability to achieve and maintain profitability; our customer and market concentration; our suppliers' abilities to deliver raw materials to our specifications and on time; our successful implementation of next-generation programs, including inventory transitions; our ability to penetrate new markets; fluctuations in our operating results from quarter to quarter; our reliance on third-party manufacturers and semiconductor foundries; acquiring businesses and integrating them with our own; component, design or manufacturing defects in our products; and our dependence on key personnel; and fluctuations in the price of our common stock. Forward-looking statements contained in this press release should be considered in light of these factors and those factors discussed from time to time in Endwave's public reports filed with the Securities and Exchange Commission, such as those discussed under "Risk Factors" in Endwave's most recent annual report on Form 10-K and quarterly report on Form 10-Q. Endwave does not undertake any obligation to update such forward-looking statements. DATASOURCE: Endwave Corporation CONTACT: Mark Hebeisen, VP Marketing & Business Development of Endwave Corporation, +1-978-686-4400, ext. 105, or ; or Jay Lawrence, Executive Director of Loea Corporation, +1-858-922-0030, or Web site: http://www.loeacom.com/ Web site: http://www.endwave.com/

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