SAN JOSE, Calif., Jan. 25, 2011 /PRNewswire/ -- Novellus Systems
(Nasdaq: NVLS) announced today that it has made multiple shipments
of its new VECTOR® Extreme™ TEOS xT™ system to leading memory
manufacturers around the world. The VECTOR Extreme TEOS xT is based
on the highly successful VECTOR Extreme platform. It is capable of
production throughputs in excess of 300 wafers per hour, making it
the fastest plasma enhanced chemical vapor deposition (PECVD)
system in the industry. In addition to its high throughput, the new
VECTOR Extreme TEOS xT achieves best-in-class nanoscale defectivity
levels, with fewer than 10 particle adders per wafer for defect
sizes greater than 70nm. This level of particle performance exceeds
the requirements for 24nm memory devices and contributes to
improving device yields. Today, over 50 percent of the total PECVD
dielectric film thickness used to manufacture DRAM and NAND Flash
memory chips is based on TEOS oxide applications.
(Photo: http://photos.prnewswire.com/prnh/20110125/SF34963)
The VECTOR Extreme TEOS xT system achieves its benchmark
performance through a combination of several new and innovative
features. Industry leading throughput is achieved using Dynamic
Plasma Control (DPC™) hardware for higher deposition rates,
RapidClean™ for faster chamber cleans, and a new xT™ wafer handler
with enhanced control system architecture for precise wafer
placement and reduced non-value-added time. The breakthrough in
defectivity performance is achieved using High Conversion
Efficiency (HCE™) vaporizer technology. Figure 1 shows controlled,
repeatable performance of less than 10 defects per wafer throughout
a 17,500 wafer marathon. In order to reduce the qualification time
for TEOS applications, the new OHD™ profile package was developed
to tune film thickness profiles to match chemical mechanical
planarization requirements. Figure 2 shows edge thick, edge thin
and flat film profiles that can be achieved using OHD technology.
Compared to the competition, the advanced features on the VECTOR
Extreme TEOS xT enable a 29 percent reduction in chemical costs and
a 25 percent reduction in energy consumption.
"Increasing demand for price-sensitive consumer products
continues to place downward price pressure on memory chips. Our
customers are looking for state-of-the-art processing equipment
that enables them to reduce their capital investment, increase
their yields, and provide them with the lowest operating costs,"
said Kevin Jennings, senior vice
president of Novellus' PECVD business unit. "The VECTOR Extreme
TEOS xT system was designed from the ground-up to meet these
demands, and is being rapidly adopted by top memory manufacturers
around the world."
For more information about the new VECTOR Extreme TEOS xT
system, please visit: www.novellustechnews.com
About Novellus' PECVD Technology:
The multi-station sequential processing (MSSP) architecture of
Novellus' VECTOR platform allows for independent temperature and
flow control to its deposition stations, a critical requirement to
meet the integration needs of sub-3xnm technology nodes. More than
1,000 VECTOR systems have been installed in logic, memory, and
foundry fabs around the world.
About Novellus:
Novellus Systems, Inc. (Nasdaq: NVLS) is a leading provider of
advanced process equipment for the global semiconductor industry.
The company's products deliver value to customers by providing
innovative technology backed by trusted productivity. An S&P
500 company, Novellus is headquartered in San Jose, Calif. with subsidiary offices
across the globe. For more information, please visit
www.novellus.com
Novellus and VECTOR are registered trademarks; and
VECTOR Extreme, TEOS xT, DPC, HCE and OHD are trademarks
of Novellus Systems, Inc.
SOURCE Novellus Systems, Inc.