BEAVERCREEK, Ohio, Sept. 19,
2024 /PRNewswire/ -- The Midwest
Microelectronics Consortium (MMEC) is excited to announce the award
of five technology development projects through Microelectronics
Commons. These five project awards designate a total first-year
funding of over $31 million of a
total proposed $130 million over the
next four years in addition to $29
million in cost share, bringing total potential project
budgets to over $138 million. These
projects will engage more than 30 MMEC members representing
organizations from industry, academia, and government stakeholders
to advance domestic microelectronic technology development to
deliver solutions to strengthen the US-based supply chain. "These
awards are the culmination of months of effort from the MMEC
members and our team," Jackie
Janning-Lask, MMEC CEO stated, "We are very excited to see
these projects awarded to the MMEC members. These projects will
play a critical role in onshoring chip development and are a
critical step in securing the US microelectronics supply
chain."
Funded by the CHIPS and Science Act, the Microelectronics
Commons program is a network of regional technology hubs focused on
expanding the nation's global leadership in microelectronics. This
program accelerates domestic prototyping and grows a pipeline of
US-based semiconductor talent. The Microelectronics Commons program
is led by the Office of the Undersecretary for Research and
Engineering, executed through the Strategic & Spectrum Missions
Advanced Resilient Trusted Systems (SĀ²MARTS) Other Transaction
Agreement (OTA) established by the Naval Surface Warfare Center
(NSWC), Crane Division and is managed by the National Security
Technology Accelerator (NSTXL).
Earlier this year, the MMEC submitted 15 tech-based proposals
that support prototype projects across six technical areas that are
critical to the Department of Defense. Those areas are: Secure Edge
Computing/Internet of Things, 5G/6G Technology, Artificial
Intelligence Hardware (AI), Quantum Technology, Electromagnetic
Warfare (EW), and Commercial Leap Ahead (CLA). The five projects
awarded to the MMEC are:
- 5G/6G: Wideband Multifunctional Software Defined
Radio (WMSDR)
Project Team Performers: Lockheed Martin, Intel,
Indiana Micro, CapV LLC, University of
Dayton, 3dGS
- Artificial Intelligence: Ultra Efficient
In-Hardware Prototype Using Hyperdimensional Computing
Project Team Performers: Intel Federal, University of Pennsylvania, SkyWater Technology,
AI-Sensation, Air Force Research Laboratory (AFRL), DEVCOM Army
Research Laboratory
- Electromagnetic Warfare: Co-packaged Reconfigurable
Signal and Intelligence Architecture
Project Team Performers: Lockheed Martin, Intel
Corporation, AFRL
- Electromagnetic Warfare: Center for Technology
Transition and Rapid Prototyping of Infrared Detectors
Project Team Performers: The Ohio
State University, Attollo Engineering, SK Infrared,
Senseeker Engineering, IQE USA,
NSWC-Crane
- Secure Edge: Validated GPU Based Secure Processing
Module
Project Team Performers: Northrop Grumman, University of Maryland, NHanced Semiconductors,
Battelle, NVIDIA
"The MMEC was formed to identify opportunities and build
collaboration between members to accelerate microelectronics
innovation. It was impressive to see how the project teams
leveraged MMECs role-based hub model to produce 15 very
high-quality proposals. Being awarded five projects really speaks
to the talent and expertise of our members and the MMEC team," said
MMEC CTO, Matt Casto PhD. "I am confident these projects will be
successfully executed and will ultimately be a huge benefit to the
US and the warfighter."
In addition to fueling research and development through the
projects, the MMEC is using funding to work with members to: 1)
utilize existing tools and machinery, and invest in new
infrastructure capabilities for expansion and modernization of
manufacturing facilities, and 2) partner with industry, academia,
and training providers to ensure that educational programs are
aligned with industry needs and that students are prepared to fill
jobs that are in high demand. The project awards will provide
funding for Workforce Development efforts, estimated at over
$2M, to create a beginning-to-end
pipeline of technology, tools, and human resources to place the US
at the forefront of microelectronics development and manufacturing.
"A skilled and diverse pipeline of workers is critical to building
a domestic, sustainable, semiconductor industry in the US. That is
why we are focused on working with our partners to reach out to
K-12, universities, and colleges to provide the next generation
with the information about how rewarding a career in the
semiconductor industry can be," stated Mrs. Janning-Lask
"In Ohio, we have always built the things that America and the
world need, from the cars we drive to the planes we fly, and soon,
it will be Ohioans who make the most advanced semiconductors on the
planet," stated JP Nauseef, JobsOhio CEO and Chairman of the MMEC
Board of Directors. "With Ohio's competitive advantage in the
Silicon Heartland, the Air Force Research Laboratory, our growing
innovation districts, and so much more, we continue to drive the
reshoring of critical technologies and the rebirth of American
manufacturing."
About the MMEC
The Midwest Microelectronics Consortium
(MMEC) leads the acceleration of microelectronic technologies and
delivers solutions to establish a trusted and resilient domestic
supply chain. The MMEC is the premier collaborative, public-private
ecosystem that engages broadly across innovative partners in
industry, academia, and government to rapidly advance defense and
commercial applications. This unique environment empowers members
to discover new technologies, share capabilities, develop a skilled
workforce, and launch groundbreaking innovation into scalable
commercial production for the benefit of National Security and
economic dominance.
For more information, contact: Karsten
Olson, MMEC, (509) 869-2846, 383557@email4pr.com,
http://www.mmeconsortium.org/
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SOURCE Midwest Microelectronics Consortium