Skyworks Powers LG's Record-Selling Shine(TM) PhoneSkyworks' Highly Integrated Quad-Band EDGE PA in LG's Shine(TM) Handset (Phot
May 21 2007 - 8:00AM
Business Wire
Skyworks Solutions, Inc. (NASDAQ:SWKS), an innovator of high
performance analog and mixed signal semiconductors enabling mobile
connectivity, today announced that it is supporting LG Electronics�
ramp of its record-selling Shine� handset. The Shine�, which is
LG�s second model from its premium Black Label Series, is
leveraging the SKY77340, a highly integrated quad-band EDGE power
amplifier � used to support the world�s largest markets in Europe
and the United States. Skyworks� modules are also being utilized
across LG�s GPRS and CDMA Chocolate� phones, which have sold ten
million units globally since the end of 2005. LG�s Shine� weighs a
mere 115 grams, stemming from its unique stainless steel material
base. Its numerous features, including expandable memory, an
auto-focus, 20 megapixel camera, comprehensive media player,
Bluetooth and USB connectivity, have also helped fuel its
exceptional consumer appeal. �Skyworks is pleased to be supporting
LG across a number of their most popular platforms,� said Brian M.
Daly, Skyworks� vice president of marketing. �Our integrated
solutions and strong capabilities across all air interfaces allow
LG and other handset manufacturers to produce feature-rich mobile
phones with ground-breaking technology and unique design that have
proven to be very popular with consumers.� LG announced at the end
of March 2007 that Shine�s� sales volume in Europe exceeded the
accumulated Shine sales in the Korean market a mere month after its
launch. In fact, UK retailer Phones4U named Shine its top-selling
phone for the two-week period after its launch, and the handsets
are also selling out in France and Germany. About Skyworks� Power
Amplifier Module The SKY77340 PAM is designed in a compact form
factor for quad-band GSM and EDGE cellular handsets. Two separate
heterojunction bipolar transistor (HBT) PA blocks are fabricated
onto indium gallium phosphide (InGaP) die. Inputs and ouputs are
impedance matched to 50 ohms, and a custom complementary metal
oxide semiconductor (CMOS) integrated circuit (IC) provides
internal multi function control (MFC) and interface circuitry. The
InGaP die, the silicon die, and passive components are mounted on a
multi-layer laminate substrate and the assembly is encapsulated
with plastic overmold. The circuitry regulates PA-bias conditions,
reducing sensitivity to temperature, power supply, and process
variation. The enable input signal provides a standby state to
minimize battery drain. All of this comes in lead (Pb)-free,
restriction of hazardous substances (RoHS)-compliant packaging.
About Skyworks Skyworks Solutions, Inc. is an innovator of high
performance analog and mixed signal semiconductors enabling mobile
connectivity. The company's power amplifiers, front-end modules and
direct conversion radios are at the heart of many of today's
leading-edge multimedia handsets. Leveraging core technologies,
Skyworks also offers a diverse portfolio of linear products that
support automotive, broadband, cellular infrastructure, industrial
and medical applications. Headquartered in Woburn, Mass., Skyworks
is worldwide with engineering, manufacturing, sales and service
facilities throughout Asia, Europe and North America. For more
information, please visit Skyworks� Web site at:
www.skyworksinc.com. Safe Harbor Statement This news release
includes "forward-looking statements" intended to qualify for the
safe harbor from liability established by the Private Securities
Litigation Reform Act of 1995. These forward-looking statements
include information relating to future results and expectations of
Skyworks (including certain projections and business trends).
Forward-looking statements can often be identified by words such as
"anticipates," "expects," "intends," "believes," "plans," "may,"
"will," "continue," similar expressions, and variations or
negatives of these words. All such statements are subject to
certain risks and uncertainties that could cause actual results to
differ materially and adversely from those projected, and may
affect our future operating results, financial position and cash
flows. These risks and uncertainties include, but are not limited
to: global economic and market conditions, such as the cyclical
nature of the semiconductor industry and the markets addressed by
our, and our customers', products; our ability to develop,
manufacture and market innovative products in a highly price
competitive and rapidly changing technological environment;
fluctuations in our manufacturing yields due to our complex and
specialized manufacturing processes; fluctuations in the
manufacturing yields of our third party semiconductor foundries and
other problems or delays in the fabrication, assembly, testing or
delivery of our products; the availability and pricing of third
party semiconductor foundry, assembly and test capacity and raw
materials; our ability to timely and accurately predict market
requirements and evolving industry standards, and to identify
opportunities in new markets; losses or curtailments of purchases
or payments from key customers, or the timing of customer inventory
adjustments; our reliance on a several key customers for a large
percentage of our sales; our ability to rapidly develop new
products and avoid product obsolescence; our ability to retain,
recruit and hire key executives, technical personnel and other
employees in the positions and numbers, with the experience and
capabilities, and at the compensation levels needed to implement
our business and product plans; lengthy product development cycles
that impact the timing of new product introductions; the timing,
rescheduling or cancellation of significant customer orders and our
ability, as well as the ability of our customers, to manage
inventory; unfavorable changes in product mix; the quality of our
products and any remediation costs; shorter than expected product
life cycles; problems or delays that we may face in shifting our
products to smaller geometry process technologies and in achieving
higher levels of design integration; economic, social and political
conditions in the countries in which we, our customers or our
suppliers operate, including security and health risks, possible
disruptions in transportation networks and fluctuations in foreign
currency exchange rates; our ability to continue to grow and
maintain an intellectual property portfolio and obtain needed
licenses from third parties; and the uncertainties of litigation,
including disputes over intellectual property, as well as other
risks and uncertainties, including but not limited to those
detailed from time to time in our filings with the Securities and
Exchange Commission. These forward-looking statements are made only
as of the date hereof, and we undertake no obligation to update or
revise the forward-looking statements, whether as a result of new
information, future events or otherwise. Note to Editors: Skyworks
and Skyworks Solutions are trademarks or registered trademarks of
Skyworks Solutions, Inc. or its subsidiaries in the United States
and in other countries. All other brands and names listed are
trademarks of their respective companies.
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