Major Asian Foundry Selects Mattson Techology for FEOL and BEOL Strip Processing in New 300 mm Fab
July 13 2004 - 9:30AM
PR Newswire (US)
Major Asian Foundry Selects Mattson Techology for FEOL and BEOL
Strip Processing in New 300 mm Fab Aspen III ICPHT Systems Support
300 mm Production Ramp FREMONT, Calif., July 13
/PRNewswire-FirstCall/ -- Mattson Technology, Inc. (NASDAQ:MTSN), a
leading supplier of advanced process equipment used to manufacture
semiconductors, today announced that one of the world's top three
dedicated semiconductor foundries has selected its new Aspen III
ICPHT strip systems to manufacture 130 nanometer (nm) and 90 nm
logic and communications devices. The systems, the first Aspen III
ICPHT tools ordered by the customer, have been recently installed
in its 300 mm fab in Singapore and will be used for both
front-end-of-line (FEOL) and back-end-of-line (BEOL) strip
processing. The multi-system sale further expands Mattson's
installed base at this major foundry and in the Asia-Pacific
region. "This customer, one of the next 300 mm adopters, chose our
Aspen III ICPHT strip systems because they demonstrated the best
overall system performance, productivity and cost of ownership,"
said Randy Matsuda, vice president and general manager of the
Films/Etch Products Group for Mattson Technology. "The systems'
advanced technology capabilities and extendibility through several
generations will be important in helping our customer to maximize
manufacturing productivity and accelerate production ramp at its
new 300 mm fab." "We are pleased to collaborate with this leading
foundry on the expansion of its new fab, where Mattson is the sole
strip supplier," said Dr. Bruno Doetsch, senior director and
general manager of Asian operations of Mattson Technology.
"Mattson's dedicated and comprehensive global service was a key
factor in this new order win, and we remain committed to delivering
the best-of-breed technologies necessary to support our long-time
foundry customer's aggressive 300 mm production ramps." About the
Aspen III ICPHT Built upon the production-proven Aspen platform,
Mattson Technology's new Aspen III ICPHT utilizes an advanced RF
plasma source and Mattson's proprietary inductively coupled plasma
(ICP) technology to provide a wider process window for FEOL and
BEOL strip applications. Featuring high-speed dual-wafer handling
and a modular, dual-chamber design, the system provides excellent
within-chamber and module-to-module repeatability. Enhanced
features include an upgraded RF assembly and a redesigned heater
block for increased strip rates, throughput, performance
(throughput and process time improvements of 100% have been
demonstrated for HDIS) and reliability. The ICPHT's high
productivity and excellent process performance provide the low CoO
required for cost-effective chip manufacturing. About Mattson
Technology, Inc. Mattson Technology, Inc. is a leading supplier of
semiconductor wafer processing equipment used in the fabrication of
integrated circuits. The company's dry strip and RTP equipment
utilize innovative technology to deliver advanced processing
capabilities on high-productivity platforms for the fabrication of
current- and next-generation devices. Since beginning operations in
1989, the company's core vision has been to help bring technology
leadership and productivity gains to semiconductor manufacturers
worldwide. For more information, please contact Mattson Technology,
Inc., 47131 Bayside Parkway, Fremont, Calif. 94538. Telephone:
800-MATTSON/ 510-657-5900. Fax: 510-492-5911. Internet:
http://www.mattson.com/. Mattson Technology Contact Lauren Vu
Mattson Technology, Inc. tel +1-510-492-6518 fax +1-510-492-2800
DATASOURCE: Mattson Technology, Inc. CONTACT: Lauren Vu of Mattson
Technology, Inc., +1-510-492-6518, or fax, +1-510-492-2800, or Web
site: http://www.mattson.com/
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