FormFactor Reduces Test Costs With New Harmony(TM) eXP Full-Wafer Contact Probe Card Solution
December 02 2008 - 8:00PM
Marketwired
FormFactor, Inc. (NASDAQ: FORM) today introduced Harmony(TM) eXP,
the latest evolution in its suite of advanced full-wafer-contact
probe cards for DRAM testing. Harmony eXP enables customers to
lower their test costs and improve their test yields on
leading-edge DRAM devices through enhancements that offer both
productivity and capability improvements. These features enable the
Harmony eXP probe card to support chipmakers' cost and test
technology roadmaps as they transition to smaller device
geometries.
The Harmony eXP platform has been qualified and adopted at
several major memory manufacturers to test 60-nm DDR2 devices. The
platform is designed to accommodate the testing of 1 GB and 2 GB
DDR 2 and DDR 3 devices at design rules ranging to 55 nm and
beyond.
"Now more than ever, DRAM manufacturers are under tremendous
pressure to reduce their production costs in order to improve their
bottom line," stated Stefan Zschiegner, senior vice president of
FormFactor's DRAM product business unit. "As an advanced probe card
supplier, FormFactor is investing in innovation to help our
customers reduce their test costs. This investment enables us to
bring out new technologies and products like our Harmony eXP
solution that improve our customers' test efficiency and provide
more test capabilities."
For higher productivity, mechanical enhancements in the Harmony
eXP platform improve planarity by more than 25 percent, and enhance
X/Y alignment precision compared to previous generation
capabilities. This precision increases customers' available
operating margins within the demanding contact alignment
requirements of shrinking device geometries. Harmony eXP also
offers dual-temperature test capability in a single probe card,
which allows customers to reduce their test costs while performing
more comprehensive stress testing.
The Harmony eXP platform supports FormFactor's recently
introduced RapidSoak(TM) technology, which maintains thermal
stability and improves scrub consistency independent of wafer chuck
movements. RapidSoak technology not only helps ensure precise and
consistent contact between the contactor on the probe card and the
test pad on the wafer to maximize test yields, but also reduces the
time required for the probe card to achieve thermal equilibrium by
as much as 50% -- increasing test cell productivity and uptime.
Continuing FormFactor's technology innovation, the Harmony eXP
also includes a new MicroSpring� contactor design that supports pad
pitches as small as 60 microns and allows a 20 percent reduction in
pad size over the previous-generation Harmony XP platform -- to
accommodate more devices per wafer. The new spring enables the
Harmony eXP probe card to achieve pin counts of 60,000 probes and
higher. Combining these advanced capabilities, the Harmony eXP
platform can test more than 1,000 DRAM devices per touchdown and is
capable (for some device designs) of supporting one touchdown
testing of a full 300-mm DRAM wafer.
Harmony eXP probe cards are now available for ordering and
shipping.
Forward-Looking Statements
Statements in this press release that are not strictly
historical in nature are forward-looking statements within the
meaning of the federal securities laws, including results the
company's customers' might realize when using the company's
products, demand for the company's products and future growth.
These forward-looking statements are based on current information
and expectations that are inherently subject to change and involve
a number of risks and uncertainties. Actual events or results might
differ materially from those in any forward-looking statement due
to various factors, including, but not limited to: the company's
ability to lower customers' test costs and improve their test
yields on leading-edge DRAM devices, to support chipmakers' cost
and test technology roadmaps as they transition to smaller device
geometries; to improve customers' test efficiency and provide them
with more test capabilities, to increase customers' available
operating margins within the contact alignment requirements of
shrinking device geometries, to enable more comprehensive stress
testing, and the company's ability to support its RapidSoak
technology within the Harmony eXP platform and maintain thermal
stability and improve scrub consistency independent of wafer chuck
movements, and reduce the time required for the probe card to
achieve thermal equilibrium. Additional information concerning
factors that could cause actual events or results to differ
materially from those in any forward-looking statement is contained
in the company's Form 10-K for the fiscal year ended December 29,
2007 and the company's Form 10-Q reports for its fiscal quarters
within 2008, filed with the Securities and Exchange Commission
("SEC"), and subsequent SEC filings. Copies of the company's SEC
filings are available at http://investors.formfactor.com/edgar.cfm.
The company assumes no obligation to update the information in this
press release, to revise any forward-looking statements or to
update the reasons actual results could differ materially from
those anticipated in forward-looking statements.
About FormFactor
Founded in 1993, FormFactor, Inc. (NASDAQ: FORM) is the leader
in advanced wafer probe cards, which are used by semiconductor
manufacturers to electrically test ICs. The company's wafer sort,
burn-in and device performance testing products move IC testing
upstream from post-packaging to the wafer level, enabling
semiconductor manufacturers to lower their overall production
costs, improve yields, and bring next-generation devices to market.
FormFactor is headquartered in Livermore, California with
operations in Europe, Asia and North America. For more information,
visit the company's web site at www.formfactor.com.
FormFactor, Harmony, Harmony eXP, MicroSpring and RapidSoak are
trademarks or registered trademarks of FormFactor, Inc.
Investor Contact: Michael Magaro Investor Relations (925)
290-4949 Email Contact Trade Press Contact: David Viera Director of
Corporate Communications (925) 290-4681 Email Contact
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