Wafer Level Chip Scale Packaging Forum Present at IMAPS in Scottsdale
March 17 2008 - 9:30AM
PR Newswire (US)
General Forum Meeting, WLCSP Specific Tracks and Papers to be
Presented SCOTTSDALE, Ariz., Mar. 17 /PRNewswire/ -- The WLCSP
Forum today announced a general meeting to be held at the Radisson
Fort McDowell Resort and Casino in Scottsdale, Arizona, on Tuesday,
March 18, 2008, at IMAPS' 4th Annual International Conference and
Exhibition on Device Packaging, March 17 through 20, 2008. The
WLCSP Forum is also hosting two WLCSP specific tracks, featuring
numerous technical papers and panel discussions. The WLCSP Forum's
objectives are to promote the adoption of semiconductor devices
using Wafer Level Chip Scale Packages (WLCSP), to establish
industry sponsored "best practices" for their utilization and to
establish strategies for migration to finer pitch WLCSP products.
Members include industry leaders such as Amkor, California Micro
Devices, Cypress, Fairchild, FlipChip, Infineon, Lord, Maxim,
Nokia, Pac Tech, STMicroelectronics, Umicore and Volterra. WLCSP
Forum General Meeting The WLCSP Forum will hold an open meeting on
March 18, 2008, at 8 PM. The purpose of this meeting is to inform
potential new members about the benefits of joining the
organization, and to answer any questions or concerns. All those
interested are invited free of charge. If you would like to attend
this meeting, contact Richard Haas, . International Conference and
Exhibition on Device Packaging in Scottsdale The WLCSP Forum will
present two tracks on CSP reliability and manufacturing issues all
day on Tuesday, March 18 at the IMAPS event. Ted Tessier, chief
technical officer of FlipChip International, and a WLCSP Forum
Board Member, will host these sessions. Go to:
http://www.imaps.org/devicepackaging. Other International Events
Planned The WLCSP Forum will be presenting papers, and will have a
booth presence at the upcoming 2nd Electronic System-Integration
Technology Conference (ESTC) in Greenwich, London, UK, on September
1-4, 2008, and at the IWLCP Conference and Exhibition in San Jose,
California, on October 15-16, 2008. More information at:
http://www.wlcspforum.org/. About the WLCSP Forum The Wafer Level
Chip Scale Packaging Forum is a California, non profit, mutual
benefit corporation focused on promoting the adoption of WLCSP
semiconductor devices. Detailed information may be accessed at
http://www.wlcspforum.org/. All trademarks are property of their
respective owners. DATASOURCE: The WLCSP Forum CONTACT: Richard
Haas of The WLCSP Forum, +1-408-934-3108, Web site:
http://www.wlcspforum.org/
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