NEW
YORK, June 20, 2024 /PRNewswire/ -- The
global die bonder equipment market size is estimated to
grow by USD 189.1 million from
2024-2028, according to Technavio. The market is estimated to grow
at a CAGR of almost 4.07% during the forecast period.
Rising electronics production across the world is driving
market growth, with a trend towards increase in number of osat
vendors. However, cyclical nature of semiconductor industry
poses a challenge. Key market players include ASMPT Ltd., BE
Semiconductor Industries NV, DIAS Automation HK Ltd., Dr. Tresky
AG, ficonTEC Service GmbH, Finetech GmbH and Co. KG, Four Technos
Co. Ltd., HYBOND Inc., Indubond, Kulicke and Soffa Industries Inc.,
MicroAssembly Technologies Ltd., Mycronic AB, Palomar Technologies
Inc., Panasonic Holdings Corp., Paroteq GmbH, SHIBAURA MECHATRONICS
CORP., SHIBUYA Corp., UniTemp GmbH, WestBond Inc., and Yamaha Motor
Co. Ltd..
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segments, customer landscape, and companies- View the
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Die Bonder Equipment
Market Scope
|
Report
Coverage
|
Details
|
Base year
|
2023
|
Historic
period
|
2018 - 2022
|
Forecast
period
|
2024-2028
|
Growth momentum &
CAGR
|
Accelerate at a CAGR of
4.07%
|
Market growth
2024-2028
|
USD 189.1
million
|
Market
structure
|
Fragmented
|
YoY growth 2022-2023
(%)
|
3.85
|
Regional
analysis
|
APAC, North America,
Europe, South America, and Middle East and Africa
|
Performing market
contribution
|
APAC at 80%
|
Key
countries
|
Taiwan, China, South
Korea, US, and Canada
|
Key companies
profiled
|
ASMPT Ltd., BE
Semiconductor Industries NV, DIAS Automation HK Ltd., Dr. Tresky
AG, ficonTEC Service GmbH, Finetech GmbH and Co. KG, Four Technos
Co. Ltd., HYBOND Inc., Indubond, Kulicke and Soffa Industries Inc.,
MicroAssembly Technologies Ltd., Mycronic AB, Palomar Technologies
Inc., Panasonic Holdings Corp., Paroteq GmbH, SHIBAURA MECHATRONICS
CORP., SHIBUYA Corp., UniTemp GmbH, WestBond Inc., and Yamaha Motor
Co. Ltd.
|
Market Driver
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Research report provides comprehensive data on
impact of trend. For more details- Download a Sample
Report
Market Challenges
•
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•
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challenges - Request a sample report!
Segment Overview
This die bonder equipment market report extensively covers
market segmentation by
- End-user
- Type
- 2.1 Fully automatic die bonder equipment
- 2.2 Semi-automatic die bonder equipment
- Geography
- 3.1 APAC
- 3.2 North America
- 3.3 Europe
- 3.4 South America
- 3.5 Middle East and
Africa
1.1 OSATs-
For more information on market segmentation with
geographical analysis including forecast (2024-2028) and historic
data (2017-2021) - Download a Sample Report
Research Analysis
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Market Research Overview
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Table of Contents:
1 Executive Summary
2 Market Landscape
3 Market Sizing
4 Historic Market Size
5 Five Forces Analysis
6 Market Segmentation
- End-user
-
- Type
-
- Fully Automatic Die Bonder Equipment
- Semi-automatic Die Bonder Equipment
- Geography
-
- APAC
- North America
- Europe
- South America
- Middle East And Africa
7 Customer Landscape
8 Geographic Landscape
9 Drivers, Challenges, and Trends
10 Company Landscape
11 Company Analysis
12 Appendix
About Technavio
Technavio is a leading global technology research and advisory
company. Their research and analysis focuses on emerging market
trends and provides actionable insights to help businesses identify
market opportunities and develop effective strategies to optimize
their market positions.
With over 500 specialized analysts, Technavio's report library
consists of more than 17,000 reports and counting, covering 800
technologies, spanning across 50 countries. Their client base
consists of enterprises of all sizes, including more than 100
Fortune 500 companies. This growing client base relies on
Technavio's comprehensive coverage, extensive research, and
actionable market insights to identify opportunities in existing
and potential markets and assess their competitive positions within
changing market scenarios.
Contacts
Technavio Research
Jesse Maida
Media & Marketing Executive
US: +1 844 364 1100
UK: +44 203 893 3200
Email: media@technavio.com
Website: www.technavio.com/
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SOURCE Technavio