KAOHSIUNG, May 19, 2024
/PRNewswire/ -- The advanced laser and plasma solution provider
from Taiwan, E&R Engineering Corp., is confirmed to attend
the feast in Semiconductor industry, Semicon SEA 2024, held in
Kuala Lumpur, Malaysia. With the
30-year dedication in the semiconductor industry, E&R had
developed a wide range of plasma and laser technology. At Semicon
SEA 2024, they will showcase their latest solutions, including:
Plasma Dicing – Small Die Dicing Solution
E&R offers a hybrid solution combining laser grooving and
plasma dicing, allowing for dice lanes controlled between 10um ~
30um. In addition to equipment manufacturing, E&R also provides
the one-stop-shop dicing service (outsourcing service) to
process wafers into small dies for various shapes, hexagonal,
circular or MPR pattern.
Advanced Packaging:
With extensive expertise in the integration of self-developed
optics module and advanced laser system, E&R provides a laser
drilling solution for 2.5D/3D packaging, featuring high accuracy up
to +/- 5um, of which the B/T ratio achieves 85~90%. Besides,
E&R is also renowned for its precision laser marking integrated
with 4 beam marking solution for high throughput while remaining
+/- 25um accuracy, excellence in heat affect control for laser
cutting process, and high uniformity (CPK >1.33) plasma
solutions.
Glass Substrate Solutions:
E&R is one of the leading equipment manufacturers supporting
glass substrate process. Besides high productivity TGV solutions
reaching 600~1,000 VPS while maintaining an accuracy of 5 um-3
sigma, E&R also provides advanced solutions for Glass Laser
Polishing to improve the roughness of glass sidewall, laser
beveling, and AOI techniques.
Silicon Carbide Solutions:
E&R provide a series of solutions including shallow layer
laser annealing after ion implantation, to activate ions and
restore the crystal lattice, SiC wafer ID marking and plasma
cleaning. Additionally, E&R also launches the Raman Inspection
Machine to detect crack, defect and internal stress, to efficiently
enhance the process yield.
FOPLP – Fan-Out Panel Level Package for 700*700mm
E&R develops a full range of machines supporting large panel
process up to 700*700mm panel size, containing laser marking,
cutting and plasma cleaning and de-smear after drilling. The
competence on warpage handling excellently reaches 16mm while
remaining the high throughput competence.
Booth Information of E&R at Semicon SEA 2024
Booth Number: #714
Hall: 2-4
Location: Malaysia International Trade and Exhibition
Center
Time: May.28th to 30th, 2024
E&R Website: https://en.enr.com.tw/
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SOURCE E&R Engineering Corp