ALMERE, The Netherlands - May 29, 2009 - ASM International N.V.
(NASDAQ: ASMI and Euronext Exchange in Amsterdam: ASM) will host an
interconnect technology seminar on Tuesday, June 2, 2009 at the
Royton Sapporo Regent Hall in Sapporo, Japan. The seminar is being
held in conjunction with the 12th IEEE International Interconnect
Technology Conference (IITC).
At the seminar, Masazumi Matsuura, Senior Engineer of Back-end Thin
Film Technology at Renesas Technology Corporation will discuss
"Technology Boosters using UV Curing for Advanced SoC Devices".
To conclude the program, ASMI will host a Poster Session
addressing Low Temperature PEALD for Spacer Defined double
Patterning, ALD for Phase Change Memory, Metal Deposition in Batch
Furnace, the Integration of Low-k Materials, and UV Cure for Logic
and Memory.
Those interested in attending this event should reply by
e-mail to IITC.Seminar@asm.com by June 2.
About ASM International
ASM International N.V., headquartered in Almere, the Netherlands, and
its subsidiaries design and manufacture equipment and materials used
to produce semiconductor devices. ASM International and its
subsidiaries provide production solutions for wafer processing
(Front-end segment) as well as assembly and packaging (Back-end
segment) through facilities in the United States, Europe, Japan and
Asia. ASM International's common stock trades on NASDAQ (symbol ASMI)
and the Euronext Amsterdam Stock Exchange (symbol ASM). For more
information, visit ASMI's website at www.asm.com.
Safe Harbor Statement under the U.S. Private Securities Litigation
Reform Act of 1995: All matters discussed in this statement, except
for any historical data, are forward-looking statements.
Forward-looking statements involve risks and uncertainties that could
cause actual results to differ materially from those in the
forward-looking statements. These include, but are not limited to,
economic conditions and trends in the semiconductor industry
generally and the timing of the industry cycles specifically,
currency fluctuations, financing and liquidity matters, the success
of restructurings, the timing of significant orders, market
acceptance of new products, competitive factors, litigation involving
intellectual property, shareholder and other issues, commercial and
economic disruption due to natural disasters, terrorist activity,
armed conflict or political instability, epidemics and other risks
indicated in the Company's filings from time to time with the U.S.
Securities and Exchange Commission, including, but not limited to,
the Company's reports on Form 20-F and Form 6-K. The Company assumes
no obligation nor intends to update or revise any forward-looking
statements to reflect future developments or circumstances.
Contacts:
Yoshida Tominori
+81 (90) 61 00 14 32
Ivo Raaijmakers
+31 (0) 6 53 43 79 40
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