Verigy Receives SEMI's First Advanced Testing Innovation Award
September 14 2010 - 4:05PM
Marketwired
Verigy (NASDAQ: VRGY), a leading semiconductor test company, has
won Semiconductor Equipment and Materials International's (SEMI)
first Advanced Testing Innovation Award, created to honor exemplary
contributions to improving functionality and efficiency in
semiconductor testing. The award was presented in Taipei by Vincent
Siew, vice president of Taiwan, Republic of China, to Rwei-Ming
Chen, Verigy's Taiwan country manager, at last week's SEMICON
Taiwan trade show.
"Verigy is being recognized by its industry colleagues for
providing advanced semiconductor-testing capabilities that enable
cost-effective production of today's and tomorrow's semiconductor
devices," said Stanley T. Myers, president and CEO of SEMI. "Such
innovative test technologies form the foundation of the entire
electronics ecosystem."
"Verigy's pioneering work in semiconductor test equipment
includes developing the industry's only scalable platforms with the
flexibility to test a wide range of semiconductor devices in
parallel," said Pascal Rondé, vice president of sales, service and
support for Verigy. "Our innovative drive is firmly fixed on
helping our customers to achieve higher productivity, get their
newest products to market faster, and become more cost
competitive."
Verigy won the award in a vote by industry members serving on
SEMI's Packaging & Test Committee in Taiwan, chaired by Dr.
Ho-Ming Tong, general manager and chief R&D officer at ASE
Group. Taiwan continues to grow its importance in the semiconductor
supply chain as leading semiconductor foundries there perform the
full spectrum of wafer fabrication and testing services.
Capable of handling a variety of frequency ranges, pin counts
and device types, Verigy's test systems help customers to shorten
their time to market and lower their overall cost of test. The
company's landmark advances include ASIC-based tester-per-pin and
tester-per-site architectures, which enable independent testing of
each device pin for highly parallel and efficient testing. In
addition, Verigy's proprietary tester-on-board™ architecture
simplifies tester hardware, configuration and system support for
more cost-effective performance.
To address the next generation of testing needs, Verigy
continues to develop innovative solutions for direct-probing of
radio-frequency (RF) communication devices and 3D IC testing. Just
introduced in June, the V93000 Direct-Probe™ solution reduces the
length and number of signal-path transitions between the tester and
probe card, bringing the industry's highest test performance to
wireless, wafer-level chip scale package, MPU and GPU devices at
wafer probe. In addition, Verigy has been actively developing 3D IC
testing technologies since 2007 and is a member of the 3D IC
Special Interest Group, which is jointly hosted by SIPO, ITRI, TSIA
and SEMI Taiwan.
About Verigy Verigy provides advanced
semiconductor test systems and solutions used by leading companies
worldwide in design validation, characterization, and high-volume
manufacturing test. Verigy offers scalable platforms for a wide
range of system-on-chip (SOC) test solutions, and memory test
solutions for Flash, DRAM including high-speed memories, as well as
multi-chip packages (MCP). Verigy also provides advanced analysis
tools that accelerate design debug and yield ramp processes.
Additional information about Verigy can be found at
www.verigy.com.
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COMPANY CONTACT: Judy Davies VP, Investor Relations and
Marketing Communications +1 408-864-7549 Email Contact
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