FSI International Receives Follow-On Order for Its ORION® System From a Leading Semiconductor Producer
November 17 2011 - 8:30AM
Business Wire
FSI International, Inc. (Nasdaq:FSII), a leading manufacturer of
surface conditioning equipment for microelectronics manufacturing,
announced today that it received a follow-on order for its ORION®
Single Wafer Cleaning System from a leading semiconductor producer.
The system will be used for BEOL applications. The company expects
to ship the system during the first half of fiscal 2012.*
Leading integrated circuit manufacturers are recognizing that
the closed chamber technology of the ORION® system, when used for
BEOL applications, delivers highly efficient removal of etch and
ash by-products without causing galvanic corrosion or changes in
metal and dielectric film properties. The process chamber design
with an integrated spray bar, improves uniformity, shortens process
time, reduces chemical consumption and enhances particle
removal.
FSI International, Inc. is a global supplier of surface
conditioning equipment, technology and support services for
microelectronics manufacturing. Using the company’s broad portfolio
of cleaning products, which include batch and single-wafer
platforms for immersion, spray and cryogenic aerosol technologies,
customers are able to achieve their process performance flexibility
and productivity goals. The company’s support services programs
provide product and process enhancements to extend the life of
installed FSI equipment, enabling worldwide customers to realize a
higher return on their capital investment. For more information,
visit FSI’s website at http://www.fsi-intl.com.
“Safe Harbor” Statement Under the Private Securities
Litigation Reform Act of 1995
This press release contains certain “forward-looking” statements
(*), including, but not limited to expected first half shipments.
Except for the historical information contained herein, the matters
discussed in this news release are forward-looking statements
involving risks and uncertainties, both known and unknown, that
could cause actual results to differ materially from those in such
forward-looking statements. Such risks and uncertainties include,
but are not limited to, changes in industry conditions; order
delays or cancellations; general economic conditions; changes in
customer capacity requirements and demand for microelectronics; the
extent of demand for the company’s products and its ability to meet
demand; global trade policies; worldwide economic and political
stability; the company’s successful execution of internal
performance plans; the cyclical nature of the company’s business;
volatility of the market for certain products; performance issues
with key suppliers and subcontractors; the level of new orders; the
timing and success of current and future product and process
development programs; the success of the company’s direct
distribution organization; legal proceedings; the potential
impairment of long-lived assets; and the potential adverse
financial impacts resulting from declines in the fair value and
liquidity of investments the company presently holds; the impact of
natural disasters on parts supply and demand for products; as well
as other factors listed herein or from time to time in the
company’s SEC reports, including our latest 10-K annual report and
10-Q quarterly reports. The company assumes no duty to update the
information in this press release.
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