FSI International Gains Acceptance for Its ORION® System from Leading Asian Foundry
September 29 2011 - 9:40AM
Business Wire
FSI International, Inc. (Nasdaq: FSII), a leading manufacturer
of surface conditioning equipment for microelectronics
manufacturing, announced today that it gained acceptance for an
ORION® Single Wafer Cleaning System from a leading Asian foundry
producer. The customer has qualified the system for
front-end-of-line (FEOL) 28 nanometer cleaning processes and will
use it for all-wet photoresist stripping applications using the
high-temperature ViPR™ process. The company expects to recognize
revenue for this system in the first quarter of fiscal 2012.
Several leading integrated circuit manufacturers are finding
that the unique closed chamber design of the ORION® System permits
safe use of aggressive, high-temperature ViPR™ process technology
for all-wet removal of highly implanted photoresist. FSI's
differentiated ViPR™ technology minimizes material loss, lowers
defectivity and has proven cost of ownership advantages. The
process chamber design with an integrated spray bar, improves
uniformity, shortens process time, reduces chemical consumption and
enhances particle removal.
FSI International, Inc. is a global supplier of surface
conditioning equipment, technology and support services for
microelectronics manufacturing. Using the company’s broad portfolio
of cleaning products, which include batch and single-wafer
platforms for immersion, spray, vapor and cryogenic aerosol
technologies, customers are able to achieve their process
performance flexibility and productivity goals. The company’s
support services programs provide product and process enhancements
to extend the life of installed FSI equipment, enabling worldwide
customers to realize a higher return on their capital investment.
For more information, visit FSI’s website at
http://www.fsi-intl.com.
“Safe Harbor” Statement Under the Private Securities
Litigation Reform Act of 1995This press release contains
certain “forward-looking” statements, including, but not limited to
expected revenue recognition timing and the ORION® products’
process performance and cost advantages. Except for order receipt
information contained herein, the matters discussed in this news
release are forward-looking statements involving risks and
uncertainties, both known and unknown, that could cause actual
results to differ materially from those in such forward-looking
statements. Such risks and uncertainties include, but are not
limited to, changes in industry conditions; order delays or
cancellations; general economic conditions; changes in customer
capacity requirements and demand for microelectronics; the extent
of demand for the company’s products and its ability to meet
demand; global trade policies; worldwide economic and political
stability; the company’s successful execution of internal
performance plans; the cyclical nature of the company’s business;
volatility of the market for certain products; performance issues
with key suppliers and subcontractors; the level of new orders; the
timing and success of current and future product and process
development programs; the success of the company’s direct
distribution organization; legal proceedings; the potential
impairment of long-lived assets; and the potential adverse
financial impacts resulting from declines in the fair value and
liquidity of investments the company presently holds; the impact of
natural disasters on parts supply and demand for products; as well
as other factors listed herein or from time to time in the
company’s SEC reports, including our latest 10-K annual report and
10-Q quarterly reports. The company assumes no duty to update the
information in this press release.
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