FSI International, Inc. (Nasdaq: FSII) announced today that a leading Asia-based logic device producer has placed additional orders for multiple ANTARES® CryoKinetic cleaning systems, further broadening the platform’s installed base. The logic chip provider currently uses the ANTARES system for various BEOL particle removal processes and with this order, is adding capacity in the 45nm technology generation at their U.S. fab. The systems are expected to ship in the second quarter of fiscal 2011. The dual process chamber ANTARES systems range in price from $1.8 to $2.3 million, depending on configuration.

The ANTARES® System is a fully automated, single-wafer, CryoKinetic system used for processing 200/300mm wafers with capabilities to remove nanoscale particles. CryoKinetic processing technology is an all-dry, non-reactive process that removes particles through impact by high-velocity cryogenic Ar/N2 aerosol, and reduces defects without damaging the wafer surface, even on copper and porous low-k films. The system’s highly efficient dry cleaning solution can be used for a variety of particle removal applications in FEOL and BEOL. Many of the leading logic device manufacturers worldwide utilize the ANTARES system for its defect reduction and yield improvement benefits.

FSI International, Inc. is a global supplier of surface conditioning equipment technology and support services for microelectronics manufacturing. Using the company’s broad portfolio of cleaning products, which include batch and single-wafer platforms for immersion, spray, vapor and cryogenic aerosol technologies, customers are able to achieve their process performance, flexibility and productivity goals. The company’s support services programs provide product and process enhancements to extend the life of installed FSI equipment, enabling worldwide customers to realize a higher return on their capital investment. FSI maintains a web site at http://www.fsi-intl.com.

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