LSI Life Storage Inc

Single line card design enables cost-effective, multi-protocol support and scalability MILPITAS, Calif., Feb. 10 /PRNewswire-FirstCall/ -- LSI Corporation (NYSE: LSI) today announced its next-generation link layer processor (LLP), a significant new addition to the LSI(TM) family of multi-service processors. A single line card design, the new LLP system-on-chip (SoC) supports all major protocols and is scalable across the bandwidth spectrum from T1/E1 to STM-1, meaning that a single OEM development effort can now be leveraged across all major services and performance levels. "The telecommunications industry is under intense pressure to integrate multiple traffic types," said Jag Bolaria, senior analyst for The Linley Group. "The LSI LLP makes integration both economically and technically feasible on a broad scale." Until now, telecom OEMs had to purchase and integrate individual cards for each major service type. The LSI LLP runs on a common, highly scalable hardware and software platform, reducing both development time and the number of cards needed to provide multiple network services. OEMs are now able to leverage a single design effort across multiple applications such as wireless base stations, wireless transport and high-end radio network controllers. "The complex mix of protocols and applications that run on today's advanced networks require highly integrated, state-of-the-art, multi-core SoCs with proven software," said Jim Anderson, vice president of sales and marketing, Semiconductor Solutions Group, LSI. "Our latest generation LLP provides OEMs with a single, scalable, highly efficient platform which enables them to build multi-service base stations that span 2G, 3G and 4G networks." In wireless applications, the LLP SoC supports backhaul of both BTS (2G) and Node B (3G) traffic to BSC (2G) and RNC (3G). Similarly, the new multi- core LLP enables the transport of multiple legacy protocols across wireline packet networks. Network uptime is maximized because the LLP continues to operate WAN modules in the event of system reboot and switches automatically to backup capacity if a system failure occurs that would otherwise impact traffic. The result is a highly efficient, highly available network capable of delivering multiple, any-to-any services. The LLP SoC provides a broad range of multi-service support including Metro Ethernet, IP, MPLS, edge-to-edge pseudo-wire emulation (PWE3) using CESoPSN, SAToP, ATM, TC/IMA, HDLC/MLPPP, AAL1, frame relay and Transcoder Rate Adaptation Unit (TRAU) protocols. The new LSI link layer processor is available now. LSI will showcase its wireless infrastructure solutions in stand AV53 at the GSMA Mobile World Congress in Barcelona, Spain, February 16 to 19. The LSI stand will be located in the Avenue Pavilion near Hall 8 of the exhibition. About LSI LSI Corporation (NYSE:LSI) is a leading provider of innovative silicon, systems and software technologies that enable products which seamlessly bring people, information and digital content together. The company offers a broad portfolio of capabilities and services including custom and standard product ICs, adapters, systems and software that are trusted by the world's best known brands to power leading solutions in the Storage and Networking markets. More information is available at http://www.lsi.com/. Editor's Notes: 1. All LSI news releases (financial, acquisitions, manufacturing, products, technology, etc.) are issued exclusively by PR Newswire and are immediately thereafter posted on the company's external website, http://www.lsi.com/. 2. LSI and the LSI logo design are trademarks or registered trademarks of LSI Corporation. 3. All other brand or product names may be trademarks or registered trademarks of their respective companies. DATASOURCE: LSI Corporation CONTACT: Dan Devine of LSI Corporation, +1-610-712-6802, Web site: http://www.lsi.com/

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