MOUNTAIN VIEW, Calif.,
Nov. 05, 2013 /PRNewswire/ -- CEVA,
Inc. (NASDAQ: CEVA), the leading licensor of silicon intellectual
property (SIP) platform solutions and DSP cores, today announced
that Spreadtrum Communications, Inc. (NASDAQ: SPRD; "Spreadtrum")
has licensed the CEVA-TeakLite-4 DSP to support advanced audio and
voice capabilities in its next-generation smartphone platform
System-on-Chip (SoCs). This enables Spreadtrum to enhance their
audio and voice processing capabilities, leveraging the latest
generation of the world's most widely deployed DSP
architecture.
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The fully programmable CEVA-TeakLite-4 DSP was specifically
designed to address the increasingly complex processing and
stringent low-power requirements of advanced voice pre-processing
and audio post-processing algorithms, including the latest
always-on voice activation typically found in high-end devices. The
CEVA-TeakLite-4's orthogonal architecture, audio- and
voice-specific instruction set, and advanced power management
provide Spreadtrum with an optimal platform with which to implement
ultra-low power audio and voice capabilities in addition to control
plane processing.
"Battery life and advanced voice processing capabilities were
two of the primary DSP selection criteria for our next-generation
smartphone platforms, and the CEVA-TeakLite-4 DSP delivers
outstandingly in both respects," said Dr. Leo Li, chairman and CEO of Spreadtrum.
"We are pleased to extend our close collaboration with CEVA,
reflecting the high level of innovation, quality and support they
consistently deliver us."
"Spreadtrum continues to lead the industry in cost-efficient,
highly-integrated smartphone platforms, enabling many millions of
people in developing nations access to the benefits of smartphone
technology annually," said Issachar
Ohana, executive vice president of worldwide sales at CEVA.
"We have enjoyed a long and successful partnership with Spreadtrum
for many years and are pleased to enhance our cooperation to
include our latest generation DSP technology."
The CEVA-TeakLite-4 is the fourth generation DSP based on the
CEVA-TeakLite architecture, the most successful licensable DSP
family in the history of the semiconductor industry, with more than
2.5 billion audio/voice chips shipped, over 100 licensees, 30
active ecosystem partners and more than 100 audio and voice
software packages available. The CEVA-TeakLite-4 is offered as a
scalable and extensible architecture framework, allowing customers
to choose the optimal family member core to address their specific
audio/voice application needs. The CEVA-TeakLite-4 is fully
compatible with previous generations of the CEVA-TeakLite family,
ensuring that the complete software portfolio of the CEVA-TeakLite
architecture runs on the CEVA-TeakLite-4 with improved efficiency.
By taking advantage of a unified development infrastructure
composed of code-compatible cores, a set of optimized software
libraries and a unified tool chain, customers can significantly
reduce software development costs while leveraging their software
investment in future products. For more information, visit
http://www.ceva-dsp.com/CEVA-TeakLite-4.
About CEVA, Inc.
CEVA is the world's leading licensor
of silicon intellectual property (SIP) DSP cores and platform
solutions for the mobile, portable and consumer electronics
markets. CEVA's IP portfolio includes comprehensive technologies
for cellular baseband (2G / 3G / 4G), multimedia (vision, imaging
and HD audio), voice processing, Bluetooth, Serial Attached SCSI
(SAS) and Serial ATA (SATA). In 2012, CEVA's IP was shipped in over
1.1 billion devices, powering smartphones from many of the world's
leading OEMs, including HTC, Huawei, LG, Nokia, Motorola, Samsung,
Sony, TCL and ZTE. Today, more than 40% of handsets shipped
worldwide are powered by a CEVA DSP core. For more information,
visit www.ceva-dsp.com. Follow CEVA on twitter at
www.twitter.com/cevadsp.
SOURCE CEVA, Inc.