Integrated Silicon Solution, Inc. Files Registration Statement for Follow-on Public Offering SANTA CLARA, Calif., Dec. 4 /PRNewswire-FirstCall/ -- Integrated Silicon Solution, Inc. announced today that it has filed a Form S-3 registration statement with the U.S. Securities and Exchange Commission (SEC) for a proposed follow-on public offering of 6,000,000 shares of its common stock, plus an over-allotment option for an additional 900,000 shares. All of the shares are being offered by the Company. Deutsche Bank Securities Inc. and SG Cowen Securities Corporation will serve as joint book-running managers for the offering, with ThinkEquity Partners LLC serving as co-managing underwriter. A registration statement relating to these securities has been filed with the SEC but has not yet become effective. These securities may not be sold nor may offers to buy be accepted prior to the time the registration statement becomes effective. This news release shall not constitute an offer to sell or the solicitation of any offer to buy, nor shall there be any sale of these securities in any state in which such an offer, solicitation or sale would be unlawful prior to the registration or qualification under the securities laws of any such state. When available, a copy of the prospectus may be obtained from the prospectus department of Deutsche Bank Securities at 60 Wall Street, 4th Floor, New York, New York 10005, telephone 212-250-2500, from the prospectus department of SG Cowen at 1155 Long Island Avenue, Edgewood, New York 11717, telephone 631-254-7106, or from the prospectus department of ThinkEquity Partners at 475 Sansome Street, Suite 800, San Francisco, California 94111, telephone 415-249-2900. About the Company ISSI is a fabless semiconductor company that designs and markets high performance integrated circuits for the following key markets: (i) digital consumer electronics, (ii) networking, (iii) mobile communications and (iv) automobile electronics. The Company's primary products are high speed and low power SRAM and low and medium density DRAM. The Company also designs and markets EEPROM, Pseudo SRAM and multi-chip packages and is developing selected non-memory products focused on its key markets. ISSI is headquartered in Silicon Valley with worldwide offices in China, Europe, Hong Kong, India, Korea and Taiwan. DATASOURCE: Integrated Silicon Solution, Inc. CONTACT: Suzanne Weaver, Investor Relations, +1-408-969-6600, or , or Gary Fischer, President & COO, +1-408-969-4612, or , both of Integrated Silicon Solution, Inc. Web site: http://www.issi.com/

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