Integrated Silicon Solution, Inc. (Nasdaq:ISSI), a leader in advanced memory solutions, today announced the addition of four new products to their low-power mobile DRAM portfolio. These 1.8V mobile 512Mb DRAMs are available in SDR (Single Data Rate) or DDR (Double Data Rate), and in 32Mx16, or 16Mx32 configurations with DDR speeds up to 333Mbps per data line. These additions to the mobile DRAM product family now, using advanced technology, enables ISSI to provide the long-term product support required by long lifecycle applications in automotive, medical, industrial and mobile communications.

Mobile DRAMs are used in a variety of applications including automotive telematics and safety, portable medical imaging and analysis equipment, smart phones, and smart meters. These mobile products use JEDEC standard 1.8V supply and I/O levels, and they feature power-saving features like temperature-compensated self-refresh (TCSR), partial array self-refresh (PASR), deep power down, and adjustable driver strength.

"The new 512Mb mobile SDR and 512Mb mobile DDR products are important additions to our DRAM portfolio of products as many automotive customers are looking for power-saving features in our DRAMs," said Lyn Zastrow, ISSI vice president of the Automotive Business Unit. "These products are used in variety of automotive applications including audio and camera functions. They are available with an operating temperature range of -40°C to 105°C, which is an added benefit that many customers have been asking for ISSI to support."

"A number of applications in the industrial and medical market are currently adopting mobile SDR and mobile DDR products," said Sean Long, director of marketing, industrial/medical/military & die products for ISSI. "Our long-term support and a broad selection of 16Mb to 512Mb mobile solutions from ISSI are instrumental factors to gain design wins in a variety of applications including smart meters and portable medical equipment."

The 32Mx16 SDR (IS42VM16320D) is available in a 54-ball BGA package, and the 32Mx16 DDR (IS43LR16320B) is available in a 60-ball BGA package. The 16Mx32 SDR (IS42VM32160D) and the DDR (IS43LR32160B) are available in a 90-ball BGA package. Temperature ranges offered are 0°C to 70°C, -40°C to 85°C, and -40°C to 105°C. These new 512Mb devices add to a complete line of mobile DRAMs from ISSI now covering densities from 16Mb to 512Mb.

In addition to the mobile SDR and DDR SDRAM product families, ISSI also offers high speed SDR, DDR, and DDR2 SDRAM product families in a variety of densities, organizations, and temperature ranges as well as a complete line of SRAMs targeted for automotive, communications, industrial, medical, military and consumer applications.

About ISSI

ISSI is a fabless semiconductor company that designs and markets high performance integrated circuits for the following key markets: (i) automotive, (ii) communications, (iii) industrial, medical, and military, and (iv) digital consumer. The Company's primary products are high speed and low power SRAM and low and medium density DRAM, and with its acquisition of Si En, the company also designs and markets high performance analog and mixed signal integrated circuits. ISSI is headquartered in Silicon Valley with worldwide offices in Taiwan, Japan, Singapore, China, Europe, Hong Kong, India, and Korea. Visit our web site at http://www.issi.com/.

The Integrated Silicon Solution, Inc. logo is available at http://www.globenewswire.com/newsroom/prs/?pkgid=4163

CONTACT: Integrated Silicon Solution, Inc.
         Ron Kalakuntla 408.969.4675
         rkalakuntla@issi.com
         Lyn Zastrow 972.393.9900
         lzastrow@issi.com
         Sean Long 408.969.4622
         slong@issi.com
         Tom Doczy 408.969.4620
         tdoczy@issi.com
         
         Shelton Group
         Leanne K. Sievers 949.224.3874
         lsievers@sheltongroup.com
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