Mindspeed’s Dual-Mode Small Cell SoCs Bring Picochip’s Widely Adopted 3G Technology to High-Performance Transcede LTE Pla...
February 15 2012 - 5:00AM
Business Wire
Mindspeed Technologies, Inc. (NASDAQ: MSPD), the industry
leader in technology for small cell base stations, today announced
the most advanced system-on-chip (SoC) solution for dual-mode
concurrent 3G and long-term evolution (LTE) operation. Mindspeed’s
latest additions to its Transcede® family of SoCs are sampling now,
and extend the company’s small cell product portfolio to include
solutions for residential, enterprise and metro infrastructure
segments. The products will incorporate widely deployed 3G
technology from Picochip, which Mindspeed acquired in January.
Mindspeed®'s Transcede family of processors are complete NodeB
and eNodeB SoC solutions that support concurrent 3G and LTE
processing in a single device, including time division synchronous
code division multiple access (TD-SCDMA), wideband code division
multiple access (WCDMA)/ evolved high speed packet access (HSPA+)
and both frequency division duplexing LTE (FDD-LTE) and time
division duplexing LTE (TDD-LTE), with a roadmap to LTE-Advanced
(LTE-A). Combining 3G and LTE processing capabilities into a single
chip is more cost effective for original equipment manufacturers
(OEMs), and the inclusion of a carrier-class physical-layer (PHY)
software solution for both 3G and LTE will accelerate time to
market, while simplifying development and reducing risk. The
Transcede T22xx series comes in product variants targeting
residential, small office/home office (SOHO) and small enterprise
applications. Multiple T33xx series options are available for
enterprise, metro and pico applications.
"We are moving quickly to combine Mindspeed’s and Picochip’s
expertise and portfolios into an offering that is uniquely
positioned to help carriers address the challenge of relentlessly
growing data demand,” said Raouf Y. Halim, chief executive officer
of Mindspeed. “Our new dual-mode solutions will enable operators to
support both 3G and LTE in a single unit, dramatically improving
their business case by delivering twice the benefit at half the
traditional per-node opex and capex costs. The Transcede devices
will also enable operators to improve existing 3G network quality,
while providing more capacity for their subscriber base without the
need for additional investments.”
Mindspeed’s T22xx and T33xx solutions support all 3GPP
standards, combining the company’s production-ready LTE PHY
software with Picochip’s field-proven HSPA software on Mindspeed’s
optimized LTE platform. Picochip has deployed more than one million
3G product units with associated PHY software, and Mindspeed has
won nearly 30 customer designs for its Transcede platform. By
offering the two companies’ small cell technologies in a single,
market-leading multi-mode platform, Mindspeed will enable wireless
carriers to upgrade their 3G networks to support what AT&T
recently estimated has been a 5000 percent increase in data demand
over the past three years alone. Small cells are seen as a crucial
component for meeting this demand by maximizing use of today’s
limited available radio spectrum.
“We expect that shipments of semiconductors for femtocells and
picocells will grow tenfold by 2017,” said Joe Madden, Principal
Analyst at Mobile Experts. “Small cells are critical for supporting
future mobile data demand, and dual-mode functionality will be
essential for the best use of limited spectrum. Mindspeed leads the
market in LTE design engagements with its Transcede family, and the
addition of Picochip’s 3G technology to this platform creates an
extremely attractive proposition for OEMs developing multi-mode
small cells.”
Technical Features
- Highly Integrated Solution: Transcede
family devices deliver dual-mode concurrent 3G and LTE processing
at the highest possible performance using a combination of the
latest ARM® Cortex A9 multi-core symmetric multiprocessing (SMP)
reduced instruction set computer (RISC) processors from ARM,
coupled with CEVA®’s latest CEVA-XC 323 digital signal processors
(DSPs). The integrated SoC reduces system latency as compared to
solutions that split processing between discrete network processors
and DSPs. Transcede devices also include built-in hardware
accelerators for important fixed functions, and integrate other key
system features to further reduce system costs and provide
sufficient processing capacity for value added applications.
- Scalable Platform for API-Compatible
Designs Spanning Broad Range of Performance Requirements: Transcede
is designed to use the same open software architecture across many
product family members, spanning multiple price and performance
points. Software developed on one Transcede device can be ported to
other family members across the full range of NodeB and eNodeB
product platforms. The latest T22xx and T33xx solutions also offer
key additional features required for small cell solutions such as
secure boot, one time programmable memories, universal subscriber
identity module (USIM) interfaces and glueless connectivity to
local radio transceivers.
Mindspeed offers the industry’s most complete portfolio of small
cell SoCs, ranging from cost-effective 3G-only residential
solutions, through the new T22xx and T33xx devices, and on up to
micro/macro-class solutions supporting hundreds of subscribers.
Transcede products are supported by a reference design that
includes RF module integration, a real-time Linux board support
package and a standards-compliant PHY implementation for LTE and
W-CDMA and TD-SCDMA, with associated utilities and test
scripts.
Mobile World Congress 2012
Mindspeed will host demonstrations and meetings for customers,
partners, press and analysts at Mobile World Congress 2012 in booth
1E.57 at the Fira Montjuïc in Barcelona, Spain from February 27 to
March 1, 2012. The new products will be shown alongside the
industry’s broadest portfolio of small cell solutions, which
includes other members of Mindspeed’s award-winning Transcede
family plus Picochip’s 3G portfolio.
Availability
The Transcede T22xx and T33xx series products are available now
in sample quantities, with volume production scheduled to begin in
the fourth calendar quarter of 2012. They are packaged in 21x21mm
and 31x31mm high-performance flip-chip ball grid array
(HFC-BGA).
About Mindspeed Technologies
Mindspeed Technologies (NASDAQ: MSPD) is a leading provider of
network infrastructure semiconductor solutions to the
communications industry. The company's low-power system-on-chip
(SoC) products are helping to drive video, voice and data
applications in worldwide fiber-optic networks and enable advanced
processing for 3G and long-term evolution (LTE) mobile networks.
The company's high-performance analog products are used in a
variety of optical, enterprise, industrial and video transport
systems. Mindspeed's products are sold to original equipment
manufacturers (OEMs) around the globe.
To learn more, please visit www.mindspeed.com. Company news
and updates are also posted at www.twitter.com/mindspeed.
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