Mattson Technology Extends Strip Productivity With New Strip System
April 19 2004 - 9:30AM
PR Newswire (US)
Mattson Technology Extends Strip Productivity With New Strip System
Aspen III ICPHT Delivers Exceptional Throughput and CoO for
High-Volume Resist Strip Applications FREMONT, Calif., April 19
/PRNewswire-FirstCall/ -- Mattson Technology, Inc. , a leading
supplier of advanced process equipment used to manufacture
semiconductors, today introduced its new Aspen III ICPHT dry strip
system. This new system provides chipmakers a significant
productivity improvement for all strip applications in high-volume
manufacturing of DRAM, logic and flash memory devices. The ICPHT
builds upon Mattson's field-proven Aspen platform, over 900 of
which are installed in customer fabs worldwide, and offers uniform
and repeatable processing while providing a wider process window
and compatibility with a variety of chemistries to handle dry strip
and residue removal applications. Utilizing an advanced RF plasma
source, based on Mattson's proprietary inductively coupled plasma
(ICP) technology, the ICPHT provides significant improvements in
process time and throughput. Throughput improvements of 100% have
been demonstrated for high-dose implant strip (HDIS), which is
generally known as one the most difficult strip applications.
Enhanced features include an upgraded RF assembly and a redesigned
heater block for increased throughput and improved process
performance and reliability. The new features are also available as
an upgrade to existing Aspen III ICP Strip systems. "Chipmakers
continue to demand a reliable, versatile dry strip system that
provides higher productivity at lower cost," said Randy Yuya
Matsuda, vice president and general manager of Mattson Technology's
Films Etch Product Group. "Our new Aspen III ICPHT strip system
combines our successful Aspen platform with enhancements that make
it one of the most flexible, efficient and cost-effective
photoresist strip systems available today. We will continue our
commitment to develop reliable, high-throughput strip tools that
provide the lowest total cost of ownership to our customers
worldwide." According to Gartner Dataquest, an independent market
research firm, the dry strip market size for 2003 was $219.1
million and is expected to grow to $327.7 million in 2004. The
addition of the ICPHT to Mattson Technology's full line of dry
strip product offerings for front-end-of-line (FEOL) and
back-end-of-line (BEOL) process applications is expected to
strengthen Mattson's leadership position and enable increased share
gains in the dry strip market. The ICPHT has already been qualified
for high-volume chip manufacturing at several key customer sites.
Shipments for volume production are expected to begin in the second
quarter of 2004. About the Aspen III ICPHT Joining Mattson
Technology's complete family of dry strip products, the Aspen III
ICPHT has been specifically designed to reduce cost of ownership
and improve productivity for high-volume strip applications. The
system builds on the production-proven Aspen platform, which has
been adopted by chipmakers worldwide for its reliability and
productivity. The ICPHT features an advanced RF plasma source,
based on Mattson's proprietary ICP technology, which both widens
the process window for advanced applications and increases strip
rate and throughput for high productivity. The system meets all
critical dry strip process requirements, including photoresist
strip and residue removal, HDIS, descum and resist recess
applications. Available in 200 mm and 300 mm versions, the Aspen
III ICPHT is based on a flexible, modular design that makes it
ideal for both development and production environments. Featuring
high-speed dual-wafer handling, the system can be configured with
up to two chamber modules that allow simultaneous processing and
give customers the flexibility to add incremental capacity. The
ICPHT provides excellent repeatability, both within each chamber
module and from module to module. The ICPHT's enhancements provide
the low cost of ownership with the high throughput and process
performance chipmakers require for cost-effective volume chip
manufacturing. About Mattson Technology, Inc. Mattson Technology,
Inc. is a leading supplier of semiconductor wafer processing
equipment used in the fabrication of integrated circuits. The
company's dry strip and RTP equipment utilize innovative technology
to deliver advanced processing capabilities on high-productivity
platforms for the fabrication of current- and next-generation
devices. Since beginning operations in 1989, the company's core
vision has been to help bring technology leadership and
productivity gains to semiconductor manufacturers worldwide. For
more information, please contact Mattson Technology, Inc., 47131
Bayside Parkway, Fremont, Calif. 94538. Telephone:
800-MATTSON/510-657-5900. Fax: 510-492-5911. Internet:
http://www.mattson.com/. CONTACT: Lauren Vu of Mattson Technology,
Inc., +1-510-492-6518, or fax, +1-510-492-2800, or . DATASOURCE:
Mattson Technology, Inc. CONTACT: Lauren Vu of Mattson Technology,
Inc., +1-510-492-6518, or fax, +1-510-492-2800, or Web site:
http://www.mattson.com/
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