MTSN Mattson Technology, Inc.

FREMONT, Calif., Dec. 6 /PRNewswire-FirstCall/ -- Mattson Technology, Inc. (NASDAQ:MTSN), a leading supplier of advanced process equipment used to manufacture semiconductors, today announced that a major Japanese logic chipmaker has selected the company's Helios RTP, Aspen III ICPHT and next-generation strip systems for use in volume production. Adding to the Aspen III Strip systems already in production at its other Japanese facilities, the ICPHT and next-generation strip systems are scheduled to ship in early 2006 to one of the chipmaker's latest state-of-the-art 300 mm fabs. The customer recently accepted the Helios at this same fab, where Mattson's other RTP system, the 3000, is currently installed. "The Helios is delivering exceptional within-wafer uniformity and wafer-to-wafer repeatability in a full array of thermal processes, while the Aspen III Strip system is established as the process of record as a result of its dependability and productivity in the most advanced dry strip applications," said Randy Y. Matsuda, Global Business Operations vice president & general manager, Asia. "Now, our ICPHT and next-generation strip tools will provide industry-leading throughput for maximum productivity and lowest cost-of-ownership. These latest orders reflect the strength of Mattson's presence in Japan, and we plan to build on our strong relationship with this customer by delivering improved value in every product generation to support the development and volume production of its logic devices." Featuring Mattson's proprietary inductively coupled plasma (ICP) source technology, the Aspen III ICPHT provides increased throughput, improved process performance and reliability for FEOL and BEOL strip applications. Our next-generation strip system combines Mattson's ICP technology with an innovative platform design, providing reduced footprint and significantly higher throughput than competitive systems. The Helios addresses the most demanding RTP applications, including nickel silicide formation and ultra-shallow junction spike anneals, enabled by advanced model-based temperature control for high productivity, excellent processing performance and superior cost-of-ownership. About Mattson Technology, Inc. Mattson Technology, Inc. is the leading supplier of dry strip equipment and the second largest supplier of rapid thermal processing equipment in the global semiconductor industry. The company's strip and RTP equipment utilize innovative technology to deliver advanced processing performance and productivity gains to semiconductor manufacturers worldwide for the fabrication of current- and next-generation devices. For more information, please contact Mattson Technology, Inc., 47131 Bayside Parkway, Fremont, Calif. 94538. Telephone: 800-MATTSON/(510) 657-5900. Fax: 510-492-5911. Internet: http://www.mattson.com/. CONTACT: Lauren Vu Mattson Technology, Inc. +1-510-492-6518 fax +1-510-492-2800 DATASOURCE: Mattson Technology, Inc. CONTACT: Lauren Vu of Mattson Technology, Inc., +1-510-492-6518, or fax, +1-510-492-2800, or Web site: http://www.mattson.com/

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