Mattson Technology's Aspen III eHighlands Selected by Major North American Chipmaker
July 13 2005 - 9:45AM
PR Newswire (US)
Mattson Technology's Aspen III eHighlands Selected by Major North
American Chipmaker New Strip System to Support Advanced 65 nm Chip
Production and 45 nm Process Development FREMONT, Calif., July 13
/PRNewswire-FirstCall/ -- Mattson Technology, Inc. (NASDAQ:MTSN), a
leading supplier of advanced process equipment used to manufacture
semiconductors, today announced that a major US chipmaker has
selected its new 300 mm Aspen III eHighlands dry strip system for
advanced 65 nm chip production and 45 nm process development. The
repeat order follows previously announced sales to a leading
Chinese foundry and ATDF, SEMATECH's R&D wafer fab in Austin,
TX. The tool, which will join other Highlands and inductively
coupled plasma (ICP) systems already installed at Mattson's
long-standing customer, is expected to ship by the end of the third
quarter 2005. "Mattson's new Aspen III eHighlands system represents
a new market opportunity for our industry-leading strip technology
and allows us to extend our strip expertise beyond the strip market
to help our customers meet the rigors of high-volume manufacturing
at the 90 nm technology node and beyond," said Randy Y. Matsuda,
vice president and general manager of Mattson Technology's Films
Etch Product Group. "Backed by our strong global customer support
programs, this second-generation system enables robust and reliable
processes for critical low-k/copper integration and other
back-end-of-line and front-end-of-line applications. This follow-on
order signifies our customer's confidence in our latest strip
tool's excellent processing performance, high throughput and
low-cost of ownership advantages and further reinforces our
leadership position in the 300 mm dry strip market. About the Aspen
III eHighlands The latest addition to Mattson's complete family of
dry strip products, the Aspen III eHighlands meets all critical
FEOL dry strip process requirements and enables chipmakers to
handle copper/low-k dielectric integration, ultra low-k ashing,
barrier layer removal and other BEOL dry strip challenges with a
single tool. With a low-pressure regime, the eHighlands provides
improved profile control, low-k material preservation and a wider
process window. Available in 200 mm and 300 mm versions, the system
builds on the production-proven Aspen III Highlands and is designed
for reliable, high-productivity, low-cost-of-ownership
manufacturing for 90 nm and below. About Mattson Technology, Inc.
Mattson Technology, Inc. is the leading supplier of dry strip
equipment and the second largest supplier of rapid thermal
processing equipment in the global semiconductor industry. The
company's strip and RTP equipment utilize innovative technology to
deliver advanced processing performance and productivity gains to
semiconductor manufacturers worldwide for the fabrication of
current- and next-generation devices. For more information, please
contact Mattson Technology, Inc., 47131 Bayside Parkway, Fremont,
Calif. 94538. Telephone: 800-MATTSON/+1-510-657-5900. Fax:
+1-510-492-5911. Internet: http://www.mattson.com/. CONTACT: Lauren
Vu Mattson Technology, Inc. +1-510-492-6518 Fax, +1-510-492-2800
DATASOURCE: Mattson Technology, Inc. CONTACT: Lauren Vu of Mattson
Technology, Inc., +1-510-492-6518, or fax, +1-510-492-2800, or Web
site: http://www.mattson.com/
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