Mattson Technology Reinforces Strip Leadership With New Strip System for Sub-90 nm Manufacturing
July 12 2005 - 9:45AM
PR Newswire (US)
Mattson Technology Reinforces Strip Leadership With New Strip
System for Sub-90 nm Manufacturing Aspen III eHighlands Delivers
Advanced Processing Capabilities for BEOL Low-k/Copper Strip
Applications FREMONT, Calif., July 12 /PRNewswire-FirstCall/ --
Mattson Technology, Inc. (NASDAQ:MTSN), a leading supplier of
advanced process equipment used to manufacture semiconductors,
today introduced its new Aspen III eHighlands dry strip system
designed for critical front-end-of-line (FEOL) and back-end-of-line
(BEOL) process applications, including photoresist strip over low-k
materials. Mattson has received multiple orders for the tool, and
the eHighlands is being qualified for 65 nm and below chip
manufacturing at key customer sites. In advanced BEOL applications,
photoresist removal processes represent major challenges to
low-k/copper (Cu) integration because conventional dry cleaning
processes introduce damage in low-k materials, leading to adverse
changes in the dielectric and the materials' physical properties.
The Aspen III eHighlands was designed to help chipmakers overcome
the integration challenges associated with these sensitive
materials. Building upon Mattson's field-proven Aspen III
Highlands, the eHighlands features Mattson's proprietary
inductively coupled plasma (ICP) source and a bias capability that
enables independent control of ion energy and ion density at low
pressures to minimize damage to low-k materials for sub-90 nm
processing. The eHighlands' unique "three-in-one" integration
scheme, where the low-k strip, barrier removal and Cu surface
treatment processes are performed in-situ, provides chipmakers up
to 35% lower cost-of-ownership than dielectric etch tools, which
use an "all-in-one" approach. "Our customers need a
high-productivity platform and a cost-effective strip solution for
their 90 nm high-volume manufacturing requirements that is easily
extendible to future process generations," said Randy Y. Matsuda,
vice president and general manager of Mattson Technology's Films
Etch Product Group. "We continue to build upon our leadership in
the strip market with the success of our Aspen platform, and our
new Aspen III eHighlands offers a full breadth of capabilities,
from cost-efficient, standard dry strip techniques to advanced
low-k/copper integration applications. We will continue to drive
advancements that will enable our customers to increase
productivity and lower costs as they move into the sub-90 nm era."
According to Gartner Dataquest, an independent market research
firm, the dry strip market size for 2004 was $351 million, and
Mattson was the number one strip supplier, leading the dry strip
industry in market share in 2004. The addition of the eHighlands to
Mattson Technology's full line of dry strip product offerings for
FEOL and BEOL process applications is expected to strengthen
Mattson's leadership position and enable increased share gains in
the dry strip market. About the Aspen III eHighlands The latest
addition to Mattson's complete family of dry strip products, the
Aspen III eHighlands meets all critical FEOL dry strip process
requirements and enables chipmakers to handle copper/low-k
dielectric integration, ultra low-k ashing, barrier layer removal
and other BEOL dry strip challenges with a single tool. With a
low-pressure regime, the eHighlands provides improved profile
control, low-k material preservation and a wider process window.
Available in 200 mm and 300 mm versions, the system builds on the
production-proven Aspen III Highlands and is designed for reliable,
high-productivity, low-cost-of-ownership manufacturing for 90 nm
and below. About Mattson Technology, Inc. Mattson Technology, Inc.
is the leading supplier of dry strip equipment and the second
largest supplier of rapid thermal processing equipment in the
global semiconductor industry. The company's strip and RTP
equipment utilize innovative technology to deliver advanced
processing performance and productivity gains to semiconductor
manufacturers worldwide for the fabrication of current- and
next-generation devices. For more information, please contact
Mattson Technology, Inc., 47131 Bayside Parkway, Fremont, Calif.
94538. Telephone: 800-MATTSON/510-657-5900. Fax: 510-492-5911.
Internet: http://www.mattson.com/. CONTACT: Lauren Vu of Mattson
Technology, Inc., +1-510-492-6518, or fax, +1-510-492-2800, or .
DATASOURCE: Mattson Technology, Inc. CONTACT: Lauren Vu of Mattson
Technology, Inc., +1-510-492-6518, or fax, +1-510-492-2800, or Web
site: http://www.mattson.com/
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