MTSN Mattson Technology, Inc.

Mattson Technology Attains #1 Market Share Position in Dry Strip and Increases Share in RTP FREMONT, Calif., April 26 /PRNewswire-FirstCall/ -- Mattson Technology, Inc. (NASDAQ:MTSN), a leading supplier of advanced process equipment used to manufacture semiconductors, today announced that the company has achieved the number one position in the $351 million dry strip market, according to a new report recently released by market research firm Gartner Dataquest for calendar year 2004. Mattson led the dry strip industry with 34.3 percent market share, an increase of ten percentage points from calendar year 2003. The company also increased its market share in the $490 million rapid thermal processing (RTP) market by almost three points to 16.7 percent, strengthening its position as the number two RTP supplier in the industry. The Gartner Dataquest results show that Mattson Technology's year-over-year growth outpaced that of the wafer fab equipment industry, with 115 percent versus 69 percent respectively. Mattson's strip business grew by over twice the industry rate, with 132 percent versus 60 percent respectively. "Our ongoing commitment to advance the performance, flexibility and productivity of our tools and technologies for our customers has enabled us to attain the number one position in the dry strip market and capture increased market share in the RTP arena," said David L. Dutton, president and chief executive officer of Mattson Technology. "These increases in market share have positioned Mattson among the top 20 wafer fab equipment suppliers and validate the success of our Aspen III ICPHT strip and Helios RTP systems in providing chipmakers the technology and economic advantages necessary for the production of next-generation integrated circuits. We intend to leverage our investment in technology and extend the processing capabilities of our systems through the 32 nanometer node to reinforce our market leadership and make further share gains." About the Aspen III ICPHT Built upon the production-proven Aspen III platform, Mattson Technology's new Aspen III ICPHT utilizes an enhanced RF plasma source with Mattson's proprietary inductively coupled plasma (ICP) technology to provide a wider process window for FEOL and BEOL strip applications. Featuring high-speed, dual-wafer handling and a modular design, the system provides the excellent process performance, high reliability, increased throughput and low cost of ownership (CoO) required for cost-effective chip manufacturing. About the Helios RTP System Mattson Technology's new Helios 300 mm RTP system features an advanced model-based temperature control approach for excellent uniformity, fast ramp and cool-down rates and closed-loop control down to 250 degrees Celsius. The Helios is built on a modular, dual-chamber platform designed for ease of maintenance, high reliability and throughput of over 120 wafers per hour, offering clear cost-of-ownership advantages. The system's high productivity and processing performance address the most demanding RTP applications, including nickel silicide formation and ultra-shallow junction spike anneals. About Mattson Technology, Inc. Mattson Technology, Inc. is the leading supplier of dry strip equipment and the second largest supplier of rapid thermal processing equipment in the global semiconductor industry. The company's strip and RTP equipment utilize innovative technology to deliver advanced processing performance and productivity gains to semiconductor manufacturers worldwide for the fabrication of current- and next-generation devices. For more information, please contact Mattson Technology, Inc., 47131 Bayside Parkway, Fremont, Calif. 94538. Telephone: 800-MATTSON/510-657-5900. Fax: 510-492-5911. Internet: http://www.mattson.com/. Lauren Vu Mattson Technology, Inc. tel: +1-510-492-6518 fax: +1-510-492-2800 DATASOURCE: Mattson Technology, Inc. CONTACT: Lauren Vu of Mattson Technology, Inc., +1-510-492-6518, or fax, +1-510-492-2800, or Web site: http://www.mattson.com/

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