Fairchild Semiconductor's Family of UltraFET Devices in MLP 3x3 Offers Industry-Leading Switching/Thermal Performance for DC/DC
November 09 2006 - 11:31AM
Business Wire
Expanding its broad portfolio of power switch solutions, Fairchild
Semiconductor (NYSE:FCS) announces new 100V, 200V and 220V
N-channel UltraFET devices available in ultra-compact (3mm x 3mm)
molded leadless packages (MLP). These devices are ideal for
primary-side switches in isolated DC/DC converter applications,
such as work stations, telecom and networking equipment, where
improving system efficiency and saving board space are mandatory
design goals. Fairchild�s 200V device, the FDMC2610, boasts the
industry�s lowest Miller charge (3nC vs. 4nC) and the lowest
on-resistance (218mOhms vs. 240mOhms) when compared with similar
200V MLP 3x3 devices on the market. These characteristics result in
a 25 percent better Figure of Merit (FOM) and translate into
superior thermal and switching performance in DC/DC converter
applications. The 200V device also offers best-in-class thermal
resistance (Theta JC) compared with similarly packaged devices
(5C/W vs. 25C/W), a heat-dissipating feature that ensures
reliability even in demanding environments. �Fairchild now offers
designers ultra-compact MLP 3x3 power switches with
industry-leading performance,� said Mike Speed, Fairchild�s market
development manager, communications. �We�ve combined the advantages
of our PowerTrench� process and advanced packaging technology to
enhance Fairchild�s UltraFET portfolio. These products are
especially tailored to meet demanding design challenges posed by
today�s DC/DC converter applications.� In addition to offering
superior thermal and switching performance over similarly packaged
MLP devices on the market, Fairchild�s UltraFET devices consume 50
percent less board space than SO-8-packaged devices typically used
in DC/DC converter designs. This package-size-reduction enables
engineers to design smaller, higher-density DC/DC converters by
reducing the MOSFET footprint area and enhancing package thermal
capability. To complement this offering of three N-channel devices,
Fairchild also introduces a 150V P-channel planar UltraFET device,
which is also available in an MLP 3x3. This device option offers
designers a complete solution for their active-clamp switch
topologies requiring both N- and P-channel MOSFETs. These lead
(Pb)-free devices meet or exceed the requirements of the joint
IPC/JEDEC standard J-STD-020C and are compliant with European Union
regulations now in effect. Price (1000 pcs): US$ 1.06--FDMC2674
(220V, N-Channel) US$ 0.96--FDMC2610 (200V, N-Channel) US$
1.11--FDM3622 (100V, N-Channel) US$ 0.78--FDMC2523P (150V,
P-Channel) Availability: Samples and demo board available now
Delivery: 8 weeks ARO Contact: To contact Fairchild Semiconductor
about these products, please go to
http://www.fairchildsemi.com/cf/sales_contacts/ For information on
other Fairchild products, design tools, and sales contacts, please
visit: http://www.fairchildsemi.com. Note to Editors: For
datasheets of these products in PDF format, go to: --
http://www.fairchildsemi.com/ds/FD/FDMC2674.pdf --
http://www.fairchildsemi.com/ds/FD/FDMC2610.pdf --
http://www.fairchildsemi.com/ds/FD/FDM3622.pdf --
http://www.fairchildsemi.com/ds/FD/FDMC2523P.pdf About Fairchild
Semiconductor: Fairchild Semiconductor (NYSE:FCS) is the leading
global supplier of high-performance power products critical to
today�s leading electronic applications in the computing,
communications, consumer, industrial and automotive segments. As
The Power Franchise�, Fairchild offers the industry�s broadest
portfolio of components that optimize system power. Fairchild�s
9,000 employees design, manufacture and market power, analog &
mixed signal, interface, logic, and optoelectronics products.
Please contact us on the web at www.fairchildsemi.com. Expanding
its broad portfolio of power switch solutions, Fairchild
Semiconductor (NYSE:FCS) announces new 100V, 200V and 220V
N-channel UltraFET devices available in ultra-compact (3mm x 3mm)
molded leadless packages (MLP). These devices are ideal for
primary-side switches in isolated DC/DC converter applications,
such as work stations, telecom and networking equipment, where
improving system efficiency and saving board space are mandatory
design goals. Fairchild's 200V device, the FDMC2610, boasts the
industry's lowest Miller charge (3nC vs. 4nC) and the lowest
on-resistance (218mOhms vs. 240mOhms) when compared with similar
200V MLP 3x3 devices on the market. These characteristics result in
a 25 percent better Figure of Merit (FOM) and translate into
superior thermal and switching performance in DC/DC converter
applications. The 200V device also offers best-in-class thermal
resistance (Theta JC) compared with similarly packaged devices
(5C/W vs. 25C/W), a heat-dissipating feature that ensures
reliability even in demanding environments. "Fairchild now offers
designers ultra-compact MLP 3x3 power switches with
industry-leading performance," said Mike Speed, Fairchild's market
development manager, communications. "We've combined the advantages
of our PowerTrench(R) process and advanced packaging technology to
enhance Fairchild's UltraFET portfolio. These products are
especially tailored to meet demanding design challenges posed by
today's DC/DC converter applications." In addition to offering
superior thermal and switching performance over similarly packaged
MLP devices on the market, Fairchild's UltraFET devices consume 50
percent less board space than SO-8-packaged devices typically used
in DC/DC converter designs. This package-size-reduction enables
engineers to design smaller, higher-density DC/DC converters by
reducing the MOSFET footprint area and enhancing package thermal
capability. To complement this offering of three N-channel devices,
Fairchild also introduces a 150V P-channel planar UltraFET device,
which is also available in an MLP 3x3. This device option offers
designers a complete solution for their active-clamp switch
topologies requiring both N- and P-channel MOSFETs. These lead
(Pb)-free devices meet or exceed the requirements of the joint
IPC/JEDEC standard J-STD-020C and are compliant with European Union
regulations now in effect. -0- *T Price (1000 pcs): US$
1.06--FDMC2674 (220V, N-Channel) US$ 0.96--FDMC2610 (200V,
N-Channel) US$ 1.11--FDM3622 (100V, N-Channel) US$ 0.78--FDMC2523P
(150V, P-Channel) Availability: Samples and demo board available
now Delivery: 8 weeks ARO Contact: To contact Fairchild
Semiconductor about these products, please go to
http://www.fairchildsemi.com/cf/sales_contacts/ For information on
other Fairchild products, design tools, and sales contacts, please
visit: http://www.fairchildsemi.com. Note to Editors: For
datasheets of these products in PDF format, go to: --
http://www.fairchildsemi.com/ds/FD/FDMC2674.pdf --
http://www.fairchildsemi.com/ds/FD/FDMC2610.pdf --
http://www.fairchildsemi.com/ds/FD/FDM3622.pdf --
http://www.fairchildsemi.com/ds/FD/FDMC2523P.pdf *T About Fairchild
Semiconductor: Fairchild Semiconductor (NYSE:FCS) is the leading
global supplier of high-performance power products critical to
today's leading electronic applications in the computing,
communications, consumer, industrial and automotive segments. As
The Power Franchise(R), Fairchild offers the industry's broadest
portfolio of components that optimize system power. Fairchild's
9,000 employees design, manufacture and market power, analog &
mixed signal, interface, logic, and optoelectronics products.
Please contact us on the web at www.fairchildsemi.com.
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