TSMC Showcases New Technology Developments at 2023 Technology Symposium
April 26 2023 - 05:00PM
Business Wire
Debuts Enhanced N3P Process, HPC-Focused N3X
Process, N3AE Auto Early Program, and Updates 2nm and TSMC
3DFabric™ Progress
TSMC (TWSE: 2330, NYSE: TSM) today showcased its latest
technology developments at its 2023 North America Technology
Symposium, including progress in 2nm technology and new members of
its industry-leading 3nm technology family, offering a range of
processes tuned to meet diverse customer demands. These include
N3P, an enhanced 3nm process for better power, performance and
density, N3X, a process tailored for high performance computing
(HPC) applications, and N3AE, enabling early start of automotive
applications on the most advanced silicon technology.
With more than 1,600 customers and partners registered to
attend, the North America Technology Symposium in Santa Clara,
California is the first of the TSMC’s Technology Symposiums around
the world in the coming months. The North America symposium also
features an Innovation Zone spotlighting the exciting technologies
of 18 emerging start-up customers.
“Our customers never stop finding new ways to harness the power
of silicon to create innovations that shall amaze the world for a
better future,” said Dr. C.C. Wei, CEO of TSMC. “In the same
spirit, TSMC never stands still, and we keep enhancing and
advancing our process technologies with more performance, power
efficiency, and functionality so their pipeline of innovation can
continue flowing for many years to come.”
Key technologies highlighted at the Symposium include:
Broader 3nm Portfolio: N3P, N3X, and N3AE – With 3nm
technology now in volume production with the N3 process and the
enhanced N3E version on the way in 2023, TSMC is adding new
variants to the roadmap to suit customers’ diverse needs.
- N3P, scheduled to enter production
in the second half of 2024, offers an additional boost to N3E with
5% more speed at the same leakage, 5-10% power reduction at the
same speed, and 1.04X more chip density.
- N3X, which prioritizes performance
and maximum clock frequencies for HPC applications, provides 5%
more speed versus N3P at drive voltage of 1.2V, with the same
improved chip density as N3P, and will enter volume production in
2025.
- N3AE, or “Auto Early”, available
in 2023, offers automotive process design kits (PDKs) based on N3E,
and allows customers to launch designs on the 3nm node for
automotive applications, leading to the fully automotive-qualified
N3A process in 2025.
2nm Technology Making Solid Progress – Development of
TSMC’s 2nm technology employing nanosheet transistors is making
solid progress in both yield and device performance, and is on
track for production in 2025. It will provide up to 15% speed
improvement over N3E at the same power, and up to 30% power
reduction at the same speed, and greater than 1.15X chip
density.
Pushing the Limits of CMOS RF Technology with N4PRF –
Beyond the N6RF technology announced in 2021, TSMC is developing
N4PRF, the industry’s most advanced CMOS radio frequency technology
for digital-intensive RF applications such as WiFi 7 RF
system-on-chip. N4PRF will support 1.77X greater logic density and
45% less logic power at the same speed compared with N6RF.
TSMC 3DFabric™ Advanced Packaging and Silicon Stacking –
major new developments in TSMC’s 3DFabric system integration
technologies include:
- Advanced Packaging – To support
the demands of HPC applications to fit more processors and memory
in a single package, TSMC is developing Chip on Wafer on Substrate
(CoWoS) solution with up to 6 times reticle-size (~5,000mm2) RDL
interposer, capable of accommodating 12 stacks of HBM memory.
- 3D Chip Stacking – TSMC announced
SoIC-P, microbump versions of its System on Integrated Chips (SoIC)
solutions providing a cost-effective way for 3D chip stacking.
SoIC-P complements TSMC’s existing bumpless solutions for
high-performance computing (HPC) applications, which are now known
as SoIC-X.
- Design Support – TSMC introdued
3Dblox™ 1.5, the newest version of its open standard design
language to lower the barriers to 3D IC design. 3Dblox™ 1.5 adds
automated bump synthesis, helping designers deal with the
complexities of large dies with thousands of bumps and potentially
reducing design times by months.
About TSMC
TSMC pioneered the pure-play foundry business model when it was
founded in 1987, and has been the world’s leading dedicated
semiconductor foundry ever since. The Company supports a thriving
ecosystem of global customers and partners with the industry’s
leading process technologies and portfolio of design enablement
solutions to unleash innovation for the global semiconductor
industry. With global operations spanning Asia, Europe, and North
America, TSMC serves as a committed corporate citizen around the
world.
TSMC deployed 288 distinct process technologies, and
manufactured 12,698 products for 532 customers in 2022 by providing
broadest range of advanced, specialty and advanced packaging
technology services. The Company is headquartered in Hsinchu,
Taiwan. For more information please visit https://www.tsmc.com.
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version on businesswire.com: https://www.businesswire.com/news/home/20230426005359/en/
TSMC Spokesperson: Wendell
Huang Vice President and CFO Tel: 886-3-505-5901
Media Contacts: Nina Kao
Head of Public Relations Tel: 886-3-563-6688 ext.7125036 Mobile:
886-988-239-163 E-Mail: nina_kao@tsmc.com
Michael Kramer Public Relations Tel: 886-3-563-6688 ext. 7125031
Mobile: 886-988-931-352 E-Mail: pdkramer@tsmc.com
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