TSMC Recognized with 2021 IEEE Corporate Innovation Award
December 08 2020 - 11:34PM
Business Wire
Recognized for leadership in 7nm semiconductor
foundry technology, enabling customers’ innovations in widespread
applications
TSMC (TWSE: 2330, NYSE: TSM) today announced that the Company
has been honored with the 2021 IEEE Corporate Innovation Award for
its leadership in 7-nanometer (7nm) semiconductor foundry
technology, which has enabled customers’ innovations in widespread
applications.
The IEEE is the world’s largest professional association
dedicated to advancing technology for humanity. First established
in 1985, its prestigious annual Corporate Innovation Award honors a
corporate, governmental, or academic organization for outstanding
innovation in an IEEE field of interest. The 2021 Corporate
Innovation Award highlights TSMC’s technology leadership along with
its Open Innovation Platform®, which have enabled many
revolutionary products in 5G mobile and energy-efficient,
high-performance computing that have brought fundamental changes to
the way we live and work.
“The IEEE extends its congratulations to TSMC for receiving the
2021 Corporate Innovation Award,” said IEEE President and CEO Dr.
Toshio Fukuda. “TSMC’s acheivements in both developing 7nm
technology, and enabling the innovations of IC designers
everywhere, have placed it among a select group of organizations
that have made lasting contributions to the field of engineering,
and to the world.”
“TSMC’s technology leadership, paired with its foundry business
model, meant that TSMC’s 7nm technology marked the first time that
the world’s most advanced logic technology was available to the
entire semiconductor industry as an open platform,” said TSMC
Chairman Dr. Mark Liu. “We are grateful to the IEEE for this
prestigious honor; it gives us further inspiration to continue
finding new ways to unleash our customers’ innovation.”
Since TSMC’s 7nm technology entered volume production in April
2018, the company has manufactured more than one billion good dies
in this process for hundreds of products from dozens of customers.
It has enabled IC designers to deliver innovations that would not
be otherwise possible in critical technology areas such as
artificial intelligence, data centers, advanced driver assistance
systems, high-performance computing, 5G communications, and
smartphones.
In order to support its customers with the broadest and most
advanced portfolio of technologies, TSMC invests approximately 8%
of its revenue on research and development, devoting US$2.96
billion in 2019 to areas including advanced logic processes, 3DIC
system integration solutions, and specialty processes. Building on
the successful 7nm platform, TSMC brought its 5nm process into
volume production in 2020, and volume production of 3nm is
scheduled for 2022.
For more on information on the IEEE Corporate Innovation Award,
please visit: https://ethw.org/IEEE_Corporate_Innovation_Award
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version on businesswire.com: https://www.businesswire.com/news/home/20201208006209/en/
TSMC Spokesperson: Wendell
Huang Vice President and CFO Tel: 886-3-505-5901
Media Contacts:
Nina Kao Head of Public
Relations Tel: 886-3-563-6688 ext.7125036 Mobile: 886-988-239-163
E-Mail: nina_kao@tsmc.com
Michael Kramer Public Relations Tel: 886-3-563-6688 ext. 7125031
Mobile: 886-988-931-352 E-Mail: pdkramer@tsmc.com
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