MELVILLE, N.Y., Dec. 1, 2020 /PRNewswire/ -- Canon
U.S.A., Inc. today announced that
its parent company, Canon Inc., will commence sales of the
FPA-3030i5a in March 2021. The FPA-3030i5a is the newest
entry in the Company's lineup of i-line1 semiconductor
lithography systems supporting manufacturing of devices including
compound semiconductors. The FPA-3030i5a is also
designed to help reduce cost of ownership (CoO), an indicator of
the total cost required for semiconductor manufacturing.
The FPA-3030i5a semiconductor lithography system, or stepper, is
designed to process small substrates between 50 mm (2 inches) and
200 mm (8 inches) in diameter. FPA-3030i5a steppers support
not only silicon wafers, but also common compound semiconductor
materials such as SiC (silicon carbide) and GaN (gallium nitride),
which helps enable the manufacturing of various semiconductor
devices that are expected to see increased demand in the future,
such as high-power devices for automobile electrification and
high-bandwidth video processing and communication devices for 5G
communication.
FPA-3030i5a stepper hardware and software have been upgraded
from its predecessor, the FPA-3030i5+ stepper (released in
June 2012), to help reduce CoO*. The
FPA-3030i5a inherits the imaging performance of the FPA-3030i5,
achieving exposure resolution of 0.35 micrometer2 line
width patterns while providing robust alignment options and
increased productivity. The FPA-3030i5a employs a high-speed wafer
feeding system that can be configured to handle a variety of wafer
materials and sizes including compound semiconductors with a
diameter from 50 mm to 200 mm.
The FPA-3030i5a uses a new off-axis alignment scope to
illuminate and measure wafer alignment marks. By not observing the
marks through the projection lens, the FPA-3030i5a alignment system
can employ a wide range of illumination wavelengths to help
optimize alignment conditions. FPA-3030i5a steppers equipped with
the optional Through-Silicon Alignment (TSA) system can also
utilize infrared light to view through substrates to enable
backside alignment processes. The new alignment system in the
FPA-3030i5a also shortens alignment mark measurement
time*.
The reduced alignment time, high-speed feeder system and
upgraded software allow the FPA-3030i5a to achieve 123 wafers per
hour (wph) output for 200 mm (8 inch) wafers, which is
approximately a 17 percent productivity improvement compared to its
predecessor*. FPA-3030i5a steppers also feature a new chamber
temperature control system that maintains the lithography system in
a clean environment and constant temperature level. The new design
helps reduce FPA-3030i5a stepper power consumption by approximately
20 percent compared to the predecessor model and through such
improvements, the system helps reduce CoO*.
Through the introduction of the FPA-3030i5a and implementation
of advanced functions, system owners are able to manufacture
specialty power and communication devices using a wide range of
wafer materials including silicon and compound semiconductors such
as SiC and GaN ranging in size from 50 mm to 200 mm.
FPA-3030i5a semiconductor lithography systems are expected to go
on sale in early March 2021.
About Canon U.S.A.,
Inc.
Canon U.S.A., Inc. is
a leading provider of consumer, business-to-business, and
industrial digital imaging solutions to the United States and to Latin America and the Caribbean markets. With approximately
$33 billion in global revenue, its
parent company, Canon Inc. (NYSE:CAJ), ranks third overall in U.S.
patents granted in 2019† and was named one of Fortune
Magazine's World's Most Admired Companies in 2020. Canon
U.S.A. is dedicated to its
Kyosei philosophy of social and environmental
responsibility. To keep apprised of the latest news from Canon
U.S.A., sign up for the Company's
RSS news feed by visiting www.usa.canon.com/rss and follow us
on Twitter @CanonUSA.
1 A semiconductor lithography system that
utilizes a 365 nm wavelength mercury lamp as the light source. 1 nm
(nanometer) is 1 billionth of a meter.
2 1 micrometer is 1 million times 1 meter (=
1000/1mm).
* According to Canon research and public third
party data, as well as industry information as of June 22nd, 2020.
†Based on weekly patent counts issued by United
States Patent and Trademark Office.
Availability and specifications are subject to change without
notice.
All referenced product names, and other marks, are trademarks of
their respective owners.
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SOURCE Canon U.S.A., Inc.