Company Secures Patent Issuance for Previously
Announced Patent Application for Ability to Fabricate Polymer
Modulators Using Chip-Scale Techniques, Enabling Simplified
High-Volume Manufacturing through Foundry-Level Packaging
ENGLEWOOD, Colo., Dec. 12,
2022 /PRNewswire/ -- Lightwave Logic, Inc. (NASDAQ:
LWLG), a technology platform company leveraging its proprietary
electro-optic polymers to transmit data at higher speeds with less
power, today announced the issuance of a U.S. patent, the
application of which was announced in June
2022, on a new invention that will enable simplified
foundry-level packaging of polymer modulators using chip-scale
techniques which can be applied at wafer level, critical for
high-volume manufacturing applications.
This patent issuance – entitled "Hybrid electro-optic polymer
modulator with atomic layer deposition (ALD) sealant layer" with
patent number US 11,506,918 B2 – allows Lightwave Logic's
proprietary polymers to be sealed to moisture and atmospheric gases
in a very low temperature and quasi-hermetic environment through
the use of a chip-scale packaging approach that can be applied in
parallel at wafer level (i.e. in volume) and that eliminates the
need for a separate hermetic enclosure or "gold box." Chip-scale
packaging is a technique that has been gathering momentum in the
silicon electronics industry for the past decade to reduce device
chip packaging costs and increase device performance – enabling
high-volume front and back-end manufacturing as well as extremely
small sizes in miniaturization.
Over the past two years, Lightwave Logic has developed its
atomic layer deposition techniques to not only seal its polymers in
a quasi-hermetic environment, but to improve both the stability and
reliability of polymer devices, without any adverse effects to
poling. The sealant process will enable lower cost system
implementation in a high-volume foundry environment. Specifically,
Lightwave Logic's electro-optic polymer modulators will be sealed
with low-temperature conformal atomic layer deposition dielectric
layers that are supported on a silicon substrate with passive
silicon photonics waveguides.
Dr. Michael Lebby, Chief
Executive Officer of Lightwave Logic, commented: "With the issuance
of this exciting new patent and our recent acquisition of low
temperature ALD processes, we continue to innovate our miniaturized
packaging techniques using ALD to align with and surpass customer
expectations. Both this patent as well as our recent low
temperature ALD processes address the accelerating trend in
photonics towards chip scale packaging, similar to what has been
used in the silicon electronics industry. Further, the potential
future impact of this invention on our foundry partners and
associated back-end process development kits (PDKs) has the
potential to be a critical feature of our next-generation polymer
platform. The timing of this invention coincides well with our work
with silicon foundries."
About Lightwave Logic, Inc.
Lightwave Logic, Inc.
(NASDAQ: LWLG) is developing a platform leveraging its proprietary
engineered electro-optic (EO) polymers to transmit data at higher
speeds with less power. The company's high-activity and
high-stability organic polymers allow Lightwave Logic to create
next-generation photonic EO devices, which convert data from
electrical signals into optical signals, for applications in data
communications and telecommunications markets. For more
information, please visit the company's website
at lightwavelogic.com.
Safe Harbor Statement
The information posted in this
release may contain forward-looking statements within the meaning
of the Private Securities Litigation Reform Act of 1995. You can
identify these statements by use of the words "may," "will,"
"should," "plans," "explores," "expects," "anticipates,"
"continue," "estimate," "project," "intend," and similar
expressions. Forward-looking statements involve risks and
uncertainties that could cause actual results to differ materially
from those projected or anticipated. These risks and uncertainties
include, but are not limited to, lack of available funding; general
economic and business conditions; competition from third parties;
intellectual property rights of third parties; regulatory
constraints; changes in technology and methods of marketing; delays
in completing various engineering and manufacturing programs;
changes in customer order patterns; changes in product mix; success
in technological advances and delivering technological innovations;
shortages in components; production delays due to performance
quality issues with outsourced components; those events and factors
described by us in Item 1.A "Risk Factors" in our most recent Form
10-K and 10-Q; other risks to which our company is subject; other
factors beyond the company's control.
Investor Relations
Contact:
Lucas
A.
Zimmerman
MZ Group - MZ North America
949-259-4987
LWLG@mzgroup.us
www.mzgroup.us
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SOURCE Lightwave Logic, Inc.