Ability to Fabricate Polymer Modulators Using
Chip-Scale Techniques Aligns the Lightwave Technology Platform with
Mainstream Silicon Electronics Chip-Scale Packaging, Enabling
Simplified High-Volume Manufacturing through Foundry-Level
Packaging
ENGLEWOOD, Colo. ,
June 23,
2022 /PRNewswire/ -- Lightwave Logic, Inc. (NASDAQ:
LWLG), a technology platform company leveraging its proprietary
electro-optic polymers to transmit data at higher speeds with less
power, today announced the publication of a U.S. patent application
on a new invention that will enable simplified foundry-level
packaging of polymer modulators using chip-scale techniques which
can be applied at wafer level, critical for high-volume
manufacturing applications.
This patent application – entitled "Hybrid electro-optic polymer
modulator with atomic layer deposition (ALD) sealant layer"
with publication number 2022/0187638A1 – allows
Lightwave Logic's proprietary polymers to be sealed to moisture and
other atmospheric gases in a very low temperature and
quasi-hermetic environment through the use of a chip-scale
packaging approach that can be applied in parallel at wafer level
(i.e. in volume) and that eliminates the need for a separate
hermetic enclosure or "gold box." Chip-scale packaging is a
technique that has been gathering momentum in the silicon
electronics industry for the past decade to reduce device chip
packaging costs and increase device performance – enabling
high-volume front and back-end manufacturing as well as extremely
small sizes in miniaturization.
Over the past two years, Lightwave Logic has optimized its
atomic layer deposition techniques to not only seal its polymers in
a quasi-hermetic environment, but to improve both the stability and
reliability of polymer devices, without any adverse effects to
poling. The sealant process will enable lower cost system
implementation in a high-volume foundry environment. Specifically,
Lightwave Logics' electro-optic polymer modulators are sealed with
a low-temperature conformal atomic layer deposition dielectic
layers that are supported on a silicon substrate with passive
silicon photonics waveguides.
Dr. Michael Lebby, Chief
Executive Officer of Lightwave Logic, commented: "We continue to
fortify our intellectual property portfolio, with this particular
patent application representing a significant breakthrough for
polymer modulator devices in general – allowing them to be
miniaturized and packaged using chip-scale-packaging techniques
popular in the silicon electronics industry today. The timing of
this invention positions us to make polymers truly ubiquitous as we
continue to simplify the production of polymer modulators for our
foundry partners.
"We are confident in the performance and stability of our
polymers and are focusing our R&D efforts on innovative new
ways to further simplify the fabrication efforts for our foundry
partners, supporting them as we position our technology platform
for high-volume manufacturing. I look forward to continued
operational execution in the months ahead as we strive to create
long-term value for our stakeholders.
About Lightwave Logic,
Inc.
Lightwave Logic, Inc. (NASDAQ: LWLG) is developing a platform
leveraging its proprietary engineered electro-optic (EO) polymers
to transmit data at higher speeds with less power. The company's
high-activity and high-stability organic polymers allow Lightwave
Logic to create next-generation photonic EO devices, which convert
data from electrical signals into optical signals, for applications
in data communications and telecommunications markets. For more
information, please visit the company's website
at lightwavelogic.com.
Safe Harbor Statement
The information posted in this release may contain
forward-looking statements within the meaning of the Private
Securities Litigation Reform Act of 1995. You can identify these
statements by use of the words "may," "will," "should," "plans,"
"explores," "expects," "anticipates," "continue," "estimate,"
"project," "intend," and similar expressions. Forward-looking
statements involve risks and uncertainties that could cause actual
results to differ materially from those projected or anticipated.
These risks and uncertainties include, but are not limited to, lack
of available funding; general economic and business conditions;
competition from third parties; intellectual property rights of
third parties; regulatory constraints; changes in technology and
methods of marketing; delays in completing various engineering and
manufacturing programs; changes in customer order patterns; changes
in product mix; success in technological advances and delivering
technological innovations; shortages in components; production
delays due to performance quality issues with outsourced
components; those events and factors described by us in Item 1.A
"Risk Factors" in our most recent Form 10-K and 10-Q; other risks
to which our Company is subject; other factors beyond the company's
control.
Investor Relations
Contact:
Lucas
A.
Zimmerman
MZ Group - MZ North America
949-259-4987
LWLG@mzgroup.us
www.mzgroup.us
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SOURCE Lightwave Logic, Inc.