New Patent Application to Simplify Fabrication of Polymer Modulators Designed to Integrate with Silicon Photonics to Enable Enhanced Internet Traffic Flow and Reduced Energy Usage

ENGLEWOOD, Colo., April 19, 2022 /PRNewswire/ -- Lightwave Logic, Inc. (NASDAQ: LWLG), a technology platform company leveraging its proprietary electro-optic polymers to transmit data at higher speeds with less power, today announced the publication of a U.S. patent application on a new invention that will simplify polymer modulator fabrication when integrated with silicon photonics for high-volume foundry manufacturing applications.

Lightwave Logic, Inc. Logo (PRNewsfoto/Lightwave Logic, Inc.)

This patent application – entitled "TFP (thin film polymer) optical transition device and method," –  illustrates the design of a simpler to fabricate, lower cost hybrid integrated photonics chip using electro-optic polymers which are more advantageous for high-volume production.  The simplified fabrication approach enables us to simplify the production of very high speed, low power proprietary polymer modulators that will enable significantly faster data rates in the internet environment.

The essence of the invention is a hybrid polymer-silicon photonics engine that fits into fiber optic transceivers (either pluggable or co-packaged) that are used in the routers, servers and network equipment that are proliferating with the growth of data centers, cloud computing and optical communications capacity.  The hybrid polymer-silicon photonics engine is designed to use high-volume silicon foundry infrastructure and is published with publication number 2022/0113566 A1. 

Dr. Michael Lebby, Chief Executive Officer of Lightwave Logic commented, "This patent application is core to our drive to provide a hybrid integrated photonics platform to boost the performance of silicon photonics technologies using our proprietary electro-optic polymers.  The patent application teaches the simplicity of fabricating the design in standard large volume silicon foundries, further simplifying manufacturing for our foundry partners.

"This is another important addition to our IP portfolio that allows our polymer technology platform to become the engine for pluggable fiber optic transceivers that are being utilized throughout internet infrastructure. You need simplicity and efficiency in chip design for foundries, and this patent application serves that purpose acutely.  With this patent application, we are changing the internet and enabling faster data – improving the lives of countless millions who rely on the internet to work, play and communicate," concluded Lebby.

About Lightwave Logic, Inc.
Lightwave Logic, Inc. (NASDAQ: LWLG) is developing a platform leveraging its proprietary engineered electro-optic (EO) polymers to transmit data at higher speeds with less power. The company's high-activity and high-stability organic polymers allow Lightwave Logic to create next-generation photonic EO devices, which convert data from electrical signals into optical signals, for applications in data communications and telecommunications markets. For more information, please visit the company's website at

Safe Harbor Statement
The information posted in this release may contain forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. You can identify these statements by use of the words "may," "will," "should," "plans," "explores," "expects," "anticipates," "continue," "estimate," "project," "intend," and similar expressions. Forward-looking statements involve risks and uncertainties that could cause actual results to differ materially from those projected or anticipated. These risks and uncertainties include, but are not limited to, lack of available funding; general economic and business conditions; competition from third parties; intellectual property rights of third parties; regulatory constraints; changes in technology and methods of marketing; delays in completing various engineering and manufacturing programs; changes in customer order patterns; changes in product mix; success in technological advances and delivering technological innovations; shortages in components; production delays due to performance quality issues with outsourced components; those events and factors described by us in Item 1.A "Risk Factors" in our most recent Form 10-K; other risks to which our Company is subject; other factors beyond the company's control.

Investor Relations Contact:        
Greg Falesnik or Luke Zimmerman          
MZ Group - MZ North America 

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