Lam Research Introduces Advanced Dielectric Gapfill Technology to Enable Next-Generation Devices
September 21 2020 - 09:30AM
Lam Research Corp. (Nasdaq: LRCX) today announced the advanced
Striker® FE platform, a new processing solution for manufacturing
high-aspect-ratio chip architectures. Striker FE utilizes an
innovative, first of its kind ICEFill™ technology for filling
extreme structures in 3D NAND, DRAM, and logic devices at emerging
nodes. This system delivers the continued cost and technology
scaling that is required to meet the semiconductor industry
roadmap.
Traditional methods of gapfill for semiconductor manufacturing
include legacy chemical vapor deposition, diffusion/furnace, and
spin-on processes. These techniques are no longer viable for
today’s 3D NAND requirements, as they are limited by the tradeoffs
between quality, shrinkage, and gapfill voids. In contrast, Lam’s
Striker ICEFill harnesses a proprietary surface modification
technique to achieve highly preferential bottom-up and void-free
gapfill while retaining the film quality inherent to atomic layer
deposition (ALD). The ICEFill technology removes the existing
limitations for filling high-aspect-ratio features which are
especially prevalent in 3D NAND devices, as well as prevents
collapse issues in DRAM and logic devices.
“Our goal is to provide customers with the most enabling ALD
technology,” said Sesha Varadarajan, senior vice president and
general manager of the Deposition product group at Lam Research.
“This technology combines the ability to produce high quality oxide
films with superior gapfill performance, in a single processing
system with the productivity advantages offered by our industry
leading quad station module architecture.”
The Striker FE platform with ICEFill technology is part of the
Striker ALD product family. For more information about the Striker
product family visit the product page.
About Lam ResearchLam Research
Corporation is a global supplier of innovative wafer
fabrication equipment and services to the semiconductor industry.
As a trusted, collaborative partner to the world’s leading
semiconductor companies, we combine superior systems engineering
capability, technology leadership, and unwavering commitment to
customer success to accelerate innovation through enhanced device
performance. In fact, today, nearly every advanced chip is built
with Lam technology. Lam Research (Nasdaq: LRCX) is a
FORTUNE 500® company headquartered in Fremont, Calif., with
operations around the globe. Learn more
at www.lamresearch.com. (LRCX-P)
Caution Regarding Forward-Looking
StatementsStatements made in this press release that are
not of historical fact are forward-looking statements and are
subject to the safe harbor provisions created by the Private
Securities Litigation Reform Act of 1995. Such forward-looking
statements relate to, but are not limited to: the performance of
the tools we sell or service and the productivity advantages of Lam
equipment. These statements are based on current expectations and
are subject to risks, uncertainties, and changes in condition,
significance, value and effect including those risks and
uncertainties that are described in the documents filed or
furnished by us with the Securities and Exchange
Commission, including specifically the Risk Factors described in
our annual report on Form 10-K for the fiscal year ended June 28,
2020. These uncertainties and changes could materially affect the
forward-looking statements and cause actual results to vary from
expectations in a material way. The Company undertakes no
obligation to update the information or statements made in this
release.
Company Contacts:Libra WhiteMedia
Relations(510) 572-7725publicrelations@lamresearch.com
Ram GaneshInvestor Relations(510)
572-1615investor.relations@lamresearch.com
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