Lam Research Breaks New Ground in Etch Technology and Productivity for Chipmaking Processes
March 03 2020 - 11:30AM
Lam Research Corp. (Nasdaq: LRCX) today announced the launch of a
completely transformed plasma etch technology and system solution,
designed to provide chipmakers with advanced functionality and
extendibility required for future innovation. Lam’s groundbreaking
Sense.i™ platform offers unparalleled system intelligence in a
compact, high-density architecture to deliver process performance
at the highest productivity, supporting logic and memory device
roadmaps through the coming decade.
With core technology evolved from Lam’s industry-leading Kiyo®
and Flex® process modules, the Sense.i platform enables the
critical etch capabilities required to continue advancing
uniformity and etch profile control for maximizing yield and
lowering wafer costs. As dimensions shrink and aspect ratios
increase, the Sense.i platform is designed to support future
technology inflections.
Powered by Lam’s Equipment Intelligence® technology, the
self-aware Sense.i platform enables semiconductor manufacturers to
capture and analyze data, identify patterns and trends, and specify
actions for improvement. Sense.i also features autonomous
calibration and maintenance capabilities that reduce downtime and
labor costs, and delivers machine learning algorithms that allow
the tool to self-adapt to minimize process variations and maximize
wafer output.
The Sense.i platform has a revolutionary space-saving
architecture that will help customers meet their future wafer
output targets by producing more than a 50% improvement in etch
output density. As semiconductor manufacturers develop smarter,
faster, and denser chips, processes are rapidly growing in
complexity and number of steps. This requires a greater number of
process chambers in a fab and reduces total output for a given
floor space. The Sense.i platform’s smaller footprint benefits
either a new fab build or a fab undergoing a node-to-node
technology conversion.
“Lam is introducing the most innovative etch product that has
been developed in the last 20 years,” said Vahid Vahedi, senior
vice president and general manager of the Etch product group at Lam
Research. “Sense.i extends our technology roadmap to meet our
customers’ next-generation requirements while solving the critical
cost scaling challenges they’re facing in their business. With more
than four million wafers processed on Lam etch systems every month,
Lam has an installed-base that provides extraordinary learning to
innovate, design, and produce the best tools for semiconductor
manufacturing.”
For more information about Sense.i visit the product page. Watch
this video for an overview of the new etch system.
About Lam ResearchLam Research
Corporation is a global supplier of innovative wafer
fabrication equipment and services to the semiconductor industry.
As a trusted, collaborative partner to the world’s leading
semiconductor companies, we combine superior systems engineering
capability, technology leadership, and unwavering commitment to
customer success to accelerate innovation through enhanced device
performance. In fact, today, nearly every advanced chip is built
with Lam technology. Lam Research (Nasdaq: LRCX) is a
FORTUNE 500® company headquartered in Fremont, Calif., with
operations around the globe. Learn more
at www.lamresearch.com. (LRCX-P)
Caution Regarding Forward-Looking
StatementsStatements made in this press release that are
not of historical fact are forward-looking statements and are
subject to the safe harbor provisions created by the Private
Securities Litigation Reform Act of 1995. Such forward-looking
statements relate to, but are not limited: the performance of the
tools we sell or service; the requirements of our customers for
future innovation and the ability of our tools to meet the
customers’ future requirements; future process requirements in the
semiconductor industry; the cost effectiveness of our tool
offerings; the learning that we may obtain from our installed base
and our ability to increase etch output density and wafer output
per area, and hence increase efficiency and output for customers.
These statements are based on current expectations and are subject
to risks, uncertainties, and changes in condition, significance,
value and effect including those risks and uncertainties that are
described in the documents filed or furnished by us
with the Securities and Exchange Commission,
including specifically our annual report on Form 10-K for the
fiscal year ended June 30, 2019 and our quarterly
reports on Form 10-Q for the fiscal
quarters ended December 29, 2019 and September 29, 2019.
These uncertainties and changes could materially affect the
forward-looking statements and cause actual results to vary from
expectations in a material way. The Company undertakes no
obligation to update the information or statements made in this
release.
Company Contacts: Libra White
Media Relations (510) 572-7725 publicrelations@lamresearch.com Ram
Ganesh Investor Relations (510) 572-1615
investor.relations@lamresearch.com
A photo accompanying this announcement is available at
https://www.globenewswire.com/NewsRoom/AttachmentNg/6e39eb23-7c15-4100-a31f-795546f25c90
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