The first in a number of new products following recent years'
R&D efforts
MIGDAL HAEMEK, Israel, Sept. 24,
2024 /PRNewswire/ -- Camtek Ltd.
(NASDAQ: CAMT) (TASE: CAMT) is pleased to announce the launch
of the latest leading inspection system, the Eagle Generation-5
(Eagle G5), marking a significant advancement in Camtek's
inspection and metrology technological capabilities. The new system
offers unparalleled wafer throughput coupled with improved optical
resolution, meeting both current market demand and customers'
future roadmap.
Camtek's Eagle system is the advanced packaging standard
solution for current and future 2D inspection and 3D metrology,
targeted to applications such as HPC (high performance computing),
CIS (CMOS image sensors), SiC (Silicon Carbide), and others. Camtek
has already received orders for this system for 2025
deliveries.
Rafi Amit, Camtek's CEO
commented, "I am very excited about the launch of our fifth
generation Eagle platform. It pushes the boundaries of performance
for inspection and metrology and I expect it to strengthen our
dominant position in both the 2D inspection and 3D metrology in
advanced packaging markets. This system is the first in a number of
new products that we have been working on in recent years and will
provide inspection and metrology solutions for the upcoming
Advanced Packaging technologies that are characterized by fine
pitch of micro bumps and hybrid bonding interconnects."
"The healthy demand in our end-markets, together with the
initial contribution from our new products, underlies our
expectations that 2025 will be another growth year for Camtek."
For more information about Camtek Ltd. and its advanced
inspection and metrology solutions, please visit
www.camtek.com.
ABOUT CAMTEK LTD.
Camtek is a developer and manufacturer of high-end inspection
and metrology equipment for the semiconductor industry. Camtek's
systems inspect IC and measure IC features on wafers throughout the
production process of semiconductor devices, covering the front and
mid-end and up to the beginning of assembly (Post Dicing). Camtek's
systems inspect wafers for the most demanding semiconductor market
segments, including Advanced Interconnect Packaging, Heterogenous
Integration, Memory and HBM, CMOS Image Sensors, Compound
Semiconductors, MEMS, and RF, serving numerous industry's leading
global IDMs, OSATs, and foundries.
With manufacturing facilities in Israel and Germany, and eight offices around the world,
Camtek provides state of the art solutions in line with customers'
requirements.
This press release is available at www.camtek.com
This press release contains statements that may constitute
"forward-looking statements" within the meaning of the Private
Securities Litigation Reform Act of 1995. Such forward-looking
statements are based on Camtek's current beliefs, expectations and
assumptions about its business and industry, all of which may
change. Forward-looking statements can be identified by the use of
words including "believe," "anticipate," "should," "intend,"
"plan," "will," "may," "expect," "estimate," "project,"
"positioned," "strategy," and similar expressions that are intended
to identify forward-looking statements, including our expectations
and statements relating to the compound semiconductors market and
our position in this market and the anticipated timing of delivery
of the systems. These forward-looking statements involve known and
unknown risks and uncertainties that may cause the actual results,
performance or achievements of Camtek to be materially
different from any future results, performance or achievements
expressed or implied by such forward-looking statements. Factors
that may cause our actual results to differ materially from those
contained in the forward-looking statements include, but are not
limited to, the effects of the evolving nature of the war
situation in Northern Israel, and
the related evolving regional conflicts; the continued demand and
future contribution of HBM and Chiplet applications and
devices to the Company business resulting from, among other things,
the field of AI surging worldwide across companies, industries and
nations; formal or informal imposition by countries of
new or revised export and/or import and doing-business regulations
or sanctions, including but not limited to changes in U.S. trade
policies, changes or uncertainty related to the U.S. government
entity list and changes in the ability to sell products
incorporating U.S originated technology, which can be made without
prior notice, and our ability to effectively address such global
trade issues and changes; ; and those other factors
discussed in our Annual Report on Form 20-F as published on
March 21, 2024 as well as
other documents filed by the Company with the SEC as well as
other documents that may be subsequently filed by Camtek from time
to time with the Securities and Exchange Commission. We caution you
not to place undue reliance on forward-looking statements, which
speak only as of the date hereof. Camtek does not assume any
obligation to update any forward-looking statements in order to
reflect events or circumstances that may arise after the date of
this release unless required by law.
While we believe that we have a reasonable basis for each
forward-looking statement contained in this press release, we
caution you that these statements are based on a combination of
facts and factors currently known by us and our projections of the
future, about which we cannot be certain. In addition, any
forward-looking statements represent Camtek's views only as of the
date of this press release and should not be relied upon as
representing its views as of any subsequent date. Camtek does not
assume any obligation to update any forward-looking statements
unless required by law.
CAMTEK LTD.
Moshe Eisenberg, CFO
Tel: +972 4 604 8308
Mobile: +972 54 900 7100
moshee@camtek.com
INTERNATIONAL INVESTOR RELATIONS
EK Global Investor Relations
Ehud Helft
Tel: (US) 1 212 378 8040
camtek@ekgir.com
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SOURCE Camtek Ltd.