Cadence Advances RF Design with the Latest AWR Design Environment Platform
June 22 2021 - 12:00PM
Business Wire
Highlights:
- AWR V16 advances heterogeneous technology development for 5G
wireless and connected systems for automotive, radar systems and
semiconductor technologies
- Custom RF to mmWave IP developed with AWR software is now
accessible across Cadence design platforms, delivering seamless
solutions for wireless systems
- Foundational advance in IC, package and PCB RF workflows
accelerates design turnaround time to align with customers’
end-market delivery time schedules
- Fully integrated FEA solver technologies deliver accurate
multiphysics (EM and thermal) systems analysis with near-linear
scalability and capacity
Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced AWR
Design Environment® Version 16 (V16) with groundbreaking
cross-platform interoperability to support RF to millimeter wave
(mmWave) intellectual property (RF IP) integration for
heterogeneous technology development across the industry-leading
Cadence® Virtuoso® design platform as well as the Allegro® PCB and
IC package design platforms. The V16 release also introduces
seamless integration with the Clarity™ 3D Solver and Celsius™
Thermal Solver, delivering unconstrained capacity for
electrothermal performance analysis of large-scale and complex RF
systems. The new AWR Design Environment, including Microwave
Office® circuit design software, enables customers to efficiently
design 5G wireless and connected systems for automotive, radar
systems, and semiconductor technologies and get to market faster.
Platform and solver integration in the V16 release provides up to a
50% reduction in turnaround time (TAT) compared to competing
workflows.
“To win today in the highly competitive 5G/wireless markets,
customers are demanding solutions that enable complete and
comprehensive RF workflows that don’t just start and stop at the
chip but extend to the entire system,” said Vinod Kariat, corporate
vice president of research and development at Cadence. “The RF
workflow innovations enabled by the AWR Design Environment V16
release start with a foundational advance in the way design data
and software IP are now shared and seamlessly transferred across
products. Under the overarching Cadence umbrella, the level of RF
integration being introduced with this release is truly an
advancement for engineering team productivity.”
Platform interoperability is crucial to expediting RF
integration and promoting engineering productivity. Seamlessly
sharing design data among the AWR Design Environment, Virtuoso, and
Allegro platforms eliminates any disconnect between RF design and
manufacturing layout teams, saves valuable engineering resources
and positively impacts development schedules. With the V16 release
and its deep electromagnetic (EM) and thermal embedded analyses,
customers are seeing more than a 3X reduction in TAT.
Key features in this release include:
- Allegro integration: Ensures manufacturing compatibility
and RF integration with PCB and IC package design flows
- Virtuoso integration: Leverages Microwave Office for RF
front-end design IP and combines it with the Virtuoso Layout Suite
for IC and module integration
- Clarity integration: Enables EM analysis for design
verification of large RF structures such as module packaging and
phased-array feed networks
- Celsius integration: Provides thermal analysis for
monolithic microwave IC (MMIC) and PCB high-power RF
applications
- AWR enhancements: Accelerates RF IP creation with
advances in design automation and finite-element analysis (FEA)
solver performance
"Cadence platforms such as the AWR Design Environment, Allegro
PCB/SiP, and Virtuoso RF with integrated EM solver technologies are
critical to the development of our RF/mmWave MMIC, RFIC and
multi-chip 2.5/3D packaging technology,” said Florian Herrault,
group leader, Advanced Packaging Solutions at HRL Laboratories.
“Our design team is very excited by the performance and
productivity gains to be had through Cadence’s RF solutions. Having
the ability to share RF IP created in Microwave Office with our IC,
package and board teams is driving a significant reduction in our
overall design time so we can deliver the highest quality products
to market faster.”
AWR Design Environment V16 supports the Cadence Intelligent
System Design™ strategy, enabling system-on-chip (SoC) design
excellence and system innovation. The V16 platform has been
released and is now available for download. For more information,
please visit www.cadence.com/go/AWRV16.
About Cadence
Cadence is a pivotal leader in electronic design, building upon
more than 30 years of computational software expertise. The company
applies its underlying Intelligent System Design strategy to
deliver software, hardware and IP that turn design concepts into
reality. Cadence customers are the world’s most innovative
companies, delivering extraordinary electronic products from chips
to boards to systems for the most dynamic market applications,
including consumer, hyperscale computing, 5G communications,
automotive, mobile, aerospace, industrial and healthcare. For seven
years in a row, Fortune magazine has named Cadence one of the 100
Best Companies to Work For. Learn more at cadence.com.
© 2021 Cadence Design Systems, Inc. All rights reserved
worldwide. Cadence, the Cadence logo and the other Cadence marks
found at www.cadence.com/go/trademarks are trademarks or registered
trademarks of Cadence Design Systems, Inc. All other trademarks are
the property of their respective owners.
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