Global Unichip Corp. Deploys Cadence Clarity 3D Solver To Achieve 5X Speedup of System Analysis for 112G Long-Reach Network S...
April 28 2021 - 10:45AM
Business Wire
Comprehensive Cadence IC Packaging Solution
Featuring Clarity 3D Solver Enables Design of Network Switch
Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that
Global Unichip Corporation (GUC) successfully deployed the Cadence®
Clarity™ 3D Solver in its simulation workflow to design a complex
network switch with hundreds of 112G PAM4 long-reach (LR) lanes. A
5X boost in simulation performance was key to GUC’s success. With
proven scalable and high-performance system analysis and
interconnect technologies, Cadence is a key enabler for hyperscale
computing applications, including cloud data center and optical
networking.
This press release features multimedia. View
the full release here:
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Left: GUC simulation results of a PAM4
112G LR lane shown in Cadence Sigrity™ SystemSI™ technology. Right:
Top and side view of a GUC network switch package design shown in
Cadence Allegro® Package Designer Plus. (Graphic: Business
Wire)
The efficiency of the Clarity 3D Solver required no partitioning
of the design, thereby eliminating any concern of inaccurate
results attributed to a fractured approach. On top of the “no
partitioning needed” benefit, the GUC engineers achieved a
five-fold speedup compared to legacy tools that relied upon
partitioning. The Clarity 3D Solver’s combination of exceptional
accuracy, speed and capacity enabled GUC to perform tradeoffs and
what-if analysis before tapeout and to optimize the detailed
ultra-scale, high-performance flip-chip BGA (HFCBGA) package design
for peak performance at the lowest cost.
Furthermore, GUC streamlined its design process by utilizing the
comprehensive Cadence IC Packaging design and analysis solution,
including the Cadence Allegro® Package Designer Plus for
implementation, Clarity 3D Solver for interconnect modeling, and
Sigrity™ SystemSI™ technology to evaluate the 112G signal quality.
The comprehensive solution embraced the integrated single-vendor
workflow from Cadence that accelerates design turnaround time,
enabling multiple optimization iterations while meeting all project
milestones.
“As an ASIC design leader, delivering advanced designs to our
customers in a timely manner is critical,” said Igor Elkanovich,
CTO of GUC. “Enhanced performance for 3D finite-element method
interconnect modeling was a key requirement for a successful
collaboration. The Cadence Clarity 3D Solver delivered
high-performance computational 3D full-wave modeling with
gold-standard accuracy, enabling us to achieve optimized signal and
power integrity along with a faster path to design closure. With a
complete Cadence flow for design, analysis and signoff, we
completed the design of a complex networking application for our
customer.”
“Exciting new technology such as Clarity 3D Solver, Celsius™
Thermal Solver, and Sigrity X are foundational to Cadence
cross-domain, multiphysics solutions addressing EM, thermal and
SI/PI for today’s electronic systems. Customer response has been
tremendous to the unprecedented performance, capacity, scalability
and accuracy of the Clarity 3D Solver performing true 3D
simulations of complete systems including interposer, package, and
PCB,” said Ben Gu, vice president of multiphysics system analysis
in the Custom IC & PCB Group at Cadence. “GUC is continuing its
design engineering excellence through design of this
next-generation data center switch, for which Cadence Allegro,
Clarity and Sigrity technologies played a significant role in the
design, analysis and signoff of hundreds of 112G LR lanes.”
The Clarity 3D Solver supports Cadence’s Intelligent System
Design™ strategy, which enables customers to accelerate system
innovation. For more information on the Clarity 3D Solver, please
visit www.cadence.com/go/clarityhyperscale.
About Cadence
Cadence is a pivotal leader in electronic design, building upon
more than 30 years of computational software expertise. The company
applies its underlying Intelligent System Design strategy to
deliver software, hardware and IP that turn design concepts into
reality. Cadence customers are the world’s most innovative
companies, delivering extraordinary electronic products from chips
to boards to systems for the most dynamic market applications,
including consumer, hyperscale computing, 5G communications,
automotive, mobile, aerospace, industrial and healthcare. For seven
years in a row, Fortune magazine has named Cadence one of the 100
Best Companies to Work For. Learn more at cadence.com.
© 2021 Cadence Design Systems, Inc. All rights reserved
worldwide. Cadence, the Cadence logo and the other Cadence marks
found at www.cadence.com/go/trademarks are trademarks or registered
trademarks of Cadence Design Systems, Inc. All other trademarks are
the property of their respective owners.
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