Broadcom Debuts Industry’s First 5nm ASIC for Data Center and Cloud Infrastructure
November 30 2020 - 9:00AM
Broadcom Inc. (NASDAQ: AVGO) today announced sampling of
its 5nm ASIC device for data center and cloud infrastructure.
Built on TSMC’s N5 process and measuring 625 mm2, this device
incorporates PCIe Gen5 protocol, 112-Gbps SerDes, HBM2e memory
operating at 3.6 Gbps, and 3.6-Tbps Die2Die PHY IP utilizing TSMC
CoWoS® interposer technology. In addition, Broadcom has multiple
ASIC devices in development targeting artificial intelligence (AI),
high performance computing (HPC) and 5G wireless infrastructure
applications.
5nm Technology
Portfolio Highlights
- High speed multi-protocol 112-Gbps, 64-Gbps and 32-Gbps SerDes
cores
- HBM2e and HBM3 protocol solution
- High bandwidth Die2Die PHY for multi-die SoC and silicon
disaggregation
- High performance and high-density standard cell libraries and
memory compilers
- Advanced packaging solutions including multi-chip-modules and
2.5D stacking
Benefits of 5nm ASIC
Platform vs. Previous
Generation
- 2x increase in on-die computation for training and inference
applications
- 2x to 4x increase in memory bandwidth with HBM2e and HBM3
PHY
- 2x higher bandwidth serial links with 112-Gbps SerDes
- Up to 30% reduction in power per given work function
- System size and cost reduction with advanced packaging
solutions
“Broadcom’s pioneering ASIC leverages both N5, the industry’s
most advanced silicon technology, and our high-performance CoWoS
integration solution to address the demanding requirements of
next-generation cloud and data center applications,” said Dr. Kevin
Zhang, senior vice president of business development at TSMC.
“We’re excited to see the new applications Broadcom’s ASIC platform
will enable, and look forward to continued partnership to empower
end customers and their innovations.”
“This first-to-market 5nm ASIC extends Broadcom’s embedded SoC
leadership and paves the way for new innovations across AI, HPC, 5G
and hyperscale infrastructure applications,” said Frank
Ostojic, senior vice president and general manager of the ASIC
Product Division at Broadcom. “Our innovative IP, proven
design methodology and partnership with TSMC continue to provide
leadership solutions with power, performance and time to market
advantage for our customers.”
About BroadcomBroadcom Inc. (NASDAQ: AVGO)
is a global technology leader that designs, develops and supplies a
broad range of semiconductor and infrastructure software solutions.
Broadcom’s category-leading product portfolio serves critical
markets including data center, networking, enterprise software,
broadband, wireless, storage and industrial. Our solutions include
data center networking and storage, enterprise, mainframe and cyber
security software focused on automation, monitoring and security,
smartphone components, telecoms and factory automation. For more
information, go to www.broadcom.com.
Broadcom, the pulse logo, and Connecting everything are among
the trademarks of Broadcom. The term "Broadcom" refers to
Broadcom Inc., and/or its subsidiaries. Other trademarks are the
property of their respective owners.
Press Contact:Khanh LamCorporate
Communicationspress.relations@broadcom.comTelephone: +1 408 433
8649
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