PITTSBURGH, May 6, 2020 /PRNewswire/
-- Ansys (NASDAQ: ANSS) achieved certification for its
next-generation system-on-chip (SoC) power noise signoff platform
for all TSMC's advanced process technologies. This helps
mutual customers verify the power requirements and reliability of
the world's largest chips for artificial intelligence, machine
learning, 5G mobile, and high-performance computing (HPC)
applications.
Enabling advanced process technologies to perform reliably in
the presence of thermal hotspots and highly variable switching
activities eliminates overdesigning power distribution networks.
But as technical constraints significantly increase, power networks
substantially grow, incorporating tens of billions of electrical
nodes that require massive parallelization and very high
capacity.
Ansys collaborates with TSMC on the certification of
Ansys® RedHawk-SC™ for TSMC's
industry-leading process nodes — including N16, N12, N7, N6
and N5 — and will work closely with TSMC on its future
process technologies. The certification includes extraction,
power integrity and reliability, signal electromigration (EM) and
thermal reliability analysis and statistical EM budgeting analysis.
Delivering tremendous speed and capacity, RedHawk-SC analyzes huge
designs by implementing the signoff algorithms on Ansys®
SeaScape™ — a highly parallelized database
derived from big data machine learning architectures and optimized
for electronic design.
"Our collaboration with Ansys has resulted in addressing
critical challenges of silicon design for applications such as 5G,
AI and HPC," said Suk Lee, senior
director of the Design Infrastructure Management Division at TSMC.
"We're looking forward to continued collaboration with Ansys to
help our mutual customers unleash their silicon innovations with
high-speed and high-capacity multiphysics signoff design solutions
on TSMC's process technologies including our 5nm technology, the
most advanced foundry solution currently available in the
world."
"The breadth and depth of our partnership with TSMC reflects the
value and need for multiphysics signoff for AI, 5G, HPC, machine
learning, networking, automotive and many other applications," said
John Lee, vice president and general
manager, Ansys. "RedHawk-SC satisfies the growing demand for
extreme parallel processing and powerful compute capacity that
responds to advances in transistor technology and supports the
increasing adoption of three-dimensional integrated
circuits-enabled packaging techniques."
About Ansys
If you've ever seen a rocket launch, flown on an airplane,
driven a car, used a computer, touched a mobile device, crossed a
bridge or put on wearable technology, chances are you've used a
product where Ansys software played a critical role in its
creation. Ansys is the global leader in engineering
simulation. Through our strategy of Pervasive Engineering
Simulation, we help the world's most innovative companies deliver
radically better products to their customers. By offering the best
and broadest portfolio of engineering simulation software, we help
them solve the most complex design challenges and create products
limited only by imagination. Founded in 1970, Ansys is
headquartered south of Pittsburgh,
Pennsylvania, U.S.A. Visit www.ansys.com for more
information.
Ansys and any and all ANSYS, Inc. brand, product, service and
feature names, logos and slogans are registered trademarks or
trademarks of ANSYS, Inc. or its subsidiaries in the United States or other countries. All
other brand, product, service and feature names or trademarks are
the property of their respective owners.
ANSS-T
Contact
|
Media
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Mary Kate
Joyce
724.820.4368
marykate.joyce@ansys.com
|
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Investors
|
Virginea
Gibson
724.820.4225
virginea.gibson@ansys.com
|
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SOURCE Ansys