Aehr Test Systems to Announce Fiscal 2019 Fourth Quarter and Full Year Financial Results on July 18, 2019
July 10 2019 - 7:30AM
Aehr Test Systems (NASDAQ: AEHR), a worldwide supplier of
semiconductor test and burn-in equipment, today announced that it
will report financial results for its fiscal 2019 fourth quarter
and full year ended May 31, 2019 on Thursday, July 18, 2019
following the close of the market. The Company will host a
conference call and webcast at 5:00 p.m. Eastern time to discuss
the results.
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What: |
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Aehr Test Systems fourth quarter
fiscal 2019 financial results conference call. |
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When: |
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Thursday, July 18th at 5:00 p.m.
Eastern Time (2:00 p.m. PT). |
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Dial in
Number: |
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To access the live call, dial
888-254-3590 (US and Canada) or
+1 323-994-2093 (International)
and give the participant passcode 7902515. |
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Webcast: |
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To access the live webcast,
please visit the investor relations section at www.aehr.com. |
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Call
Replay: |
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A phone replay of the call will
be available approximately two hours following the end of the call
through 8:00 p.m. ET on Thursday, July 25, 2019. To access the
replay dial-in information, please click here. |
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About Aehr Test SystemsHeadquartered in
Fremont, California, Aehr Test Systems is a worldwide provider of
test systems for burning-in and testing logic, optical and memory
integrated circuits and has over 2,500 systems installed worldwide.
Increased quality and reliability needs of the Automotive and
Mobility integrated circuit markets are driving additional test
requirements, incremental capacity needs, and new opportunities for
Aehr Test products in package, wafer level, and singulated
die/module level test. Aehr Test has developed and introduced
several innovative products, including the ABTS™ and
FOX-P™ families of test and burn-in systems and FOX
WaferPak™ Aligner, FOX-XP WaferPak Contactor, FOX DiePak®
Carrier and FOX DiePak Loader. The ABTS system is used in
production and qualification testing of packaged parts for both
lower power and higher power logic devices as well as all common
types of memory devices. The FOX-XP and FOX-NP systems are full
wafer contact and singulated die/module test and burn-in systems
used for burn-in and functional test of complex devices, such as
leading-edge memories, digital signal processors, microprocessors,
microcontrollers, systems-on-a-chip, and integrated optical
devices. The FOX-CP system is a new low-cost single-wafer compact
test and reliability verification solution for logic, memory and
photonic devices and the newest addition to the FOX-P product
family. The WaferPak contactor contains a unique full wafer probe
card capable of testing wafers up to 300mm that enables IC
manufacturers to perform test and burn-in of full wafers on Aehr
Test FOX systems. The DiePak Carrier is a reusable, temporary
package that enables IC manufacturers to perform cost-effective
final test and burn-in of both bare die and modules. For more
information, please visit Aehr Test Systems’ website at
www.aehr.com.
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Contacts: |
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Aehr Test
Systems |
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MKR Investor Relations
Inc. |
Ken Spink |
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Todd Kehrli or Jim Byers |
Chief Financial Officer |
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Analyst/Investor Contact |
(510) 623-9400 x309 |
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(323) 468-2300 |
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aehr@mkr-group.com |
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