ACM Research Enters 3D TSV Copper Plating Market with Ultra ECP 3d Platform
November 19 2020 - 4:15PM
ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of
wafer processing solutions for semiconductor and advanced
wafer-level packaging (WLP) applications, today introduced its
Ultra ECP 3d platform for conformally filled 3D through-silicon via
(TSV) applications. Leveraging ACM's Ultra ECP ap and map
platforms, the Ultra ECP 3d platform delivers high-performance
copper (Cu) electroplating for high aspect ratio (HAR) Cu
applications, with no voids or seams.
According to industry research firm Mordor Intelligence, “The 3D
TSV Devices Market was valued at USD $2.8 billion in 2019 and is
expected to reach USD $4.0 billion by 2025, at a CAGR of 6.2% over
the forecast period 2020 - 2025.”1 Key markets for devices using
TSVs include imaging, memory, MEMS and optoelectronics, among
others.
“Many factors are driving the growth of the 3D TSV market, from
device miniaturization to AI and edge computing,” said David Wang,
CEO of ACM. “These applications demand more processing power in
ever higher density packages and are leading to rapid industry
adoption of TSV technologies.”
“In working with customers, we’ve successfully demonstrated our
ability to fill HAR vias using the Ultra ECP 3d platform. In
addition to delivering higher throughput with a stacked chamber
design, the platform is designed to use fewer consumables, have a
lower total cost of ownership, and save valuable fab floor space,”
he added.
During bottom-up filling for HAR TSVs, the Cu electrolyte must
be able to completely fill the vias without any trapped air bubbles
when immersed in the plating solution. To accelerate this process,
an integrated pre-wet step is used.
This advanced technology solution can deliver better yields,
greater plating efficiency and higher throughput during the
fabrication process. The Ultra ECP 3d platform for 3D TSV is a
10-chamber, 300mm tool with integrated pre-wet, Cu plating and
post-clean modules in a footprint of only 2.20m × 3.60m × 2.90m
(W/L/H).
ACM recently delivered its first Ultra ECP 3d tool to a key
customer in China to begin formal qualification for its 3D TSV and
2.5D interposer Cu plating applications. For more information,
please call the ACM regional company contact listed below.
About ACM Research, Inc.ACM develops,
manufactures and sells semiconductor process equipment for
single-wafer or batch wet cleaning, electroplating, stress-free
polishing and thermal processes that are critical to advanced
semiconductor device manufacturing as well as wafer-level
packaging. The company is committed to delivering customized,
high-performance, cost-effective process solutions that
semiconductor manufacturers can use in numerous manufacturing steps
to improve productivity and product yield.
The ACM Research logo is a trademark of ACM Research, Inc. For
convenience, this trademark appears in this press release without a
™ symbol, but that practice does not mean that ACM will not assert,
to the fullest extent under applicable law, its rights to the
trademark.
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https://www.mordorintelligence.com/industry-reports/3d-tsv-devices-market
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Media Contact:Eric LawsonKiterocket+1
480.276.9572elawson@kiterocket.com |
Company Contacts: U.S. Robert MetterACM
Research, Inc.+1-503-367-9753 |
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EuropeSally-Ann HenryACM Research, Inc.+43 660 7769721 |
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ChinaXi WangACM Research (Shanghai), Inc.+86 21 50808868 |
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Korea YY KimACM Research (Korea), Inc.+821041415171 |
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SingaporeAdrian OngACM Research (Singapore), Inc.+65
8813-1107 |
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TaiwanDavid ChangACM Research (Taiwan), Inc.+866
921-999-884 |
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